S-24CS64A0I-T8T1G
vs
BR24L02-W
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SEIKO INSTRUMENTS USA INC
|
ROHM CO LTD
|
| Package Description |
LEAD FREE, TSSOP-8
|
DIP, DIP8,.3
|
| Reach Compliance Code |
compliant
|
compliant
|
| Clock Frequency-Max (fCLK) |
0.4 MHz
|
0.4 MHz
|
| Data Retention Time-Min |
10
|
40
|
| Endurance |
100000 Write/Erase Cycles
|
1000000 Write/Erase Cycles
|
| I2C Control Byte |
1010DDDR
|
1010DDDR
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDIP-T8
|
| JESD-609 Code |
e6
|
e2
|
| Length |
4.4 mm
|
9.3 mm
|
| Memory Density |
65536 bit
|
2048 bit
|
| Memory IC Type |
EEPROM
|
EEPROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
8192 words
|
256 words
|
| Number of Words Code |
8000
|
256
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
8KX8
|
256X8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
DIP
|
| Package Equivalence Code |
TSSOP8,.25
|
DIP8,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
IN-LINE
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.1 mm
|
3.7 mm
|
| Serial Bus Type |
I2C
|
I2C
|
| Standby Current-Max |
0.000003 A
|
0.000002 A
|
| Supply Current-Max |
0.004 mA
|
0.002 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
1.8 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
2.5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN BISMUTH
|
Tin/Copper (Sn/Cu)
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
0.65 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
3 mm
|
7.62 mm
|
| Write Cycle Time-Max (tWC) |
10 ms
|
5 ms
|
| Write Protection |
HARDWARE
|
HARDWARE
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
8
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.32.00.51
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
10
|
|
|
|
Compare S-24CS64A0I-T8T1G with alternatives
Compare BR24L02-W with alternatives