S-93C66ADP-P vs AT93C66A-10PU-1.8 feature comparison

S-93C66ADP-P ABLIC Inc.

Buy Now Datasheet

AT93C66A-10PU-1.8 Microchip Technology Inc

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SEIKO INSTRUMENTS USA INC MICROCHIP TECHNOLOGY INC
Part Package Code DIP
Package Description DIP,
Pin Count 8
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.32.00.51
Clock Frequency-Max (fCLK) 2 MHz
JESD-30 Code R-PDIP-T8
Length 9.3 mm
Memory Density 4096 bit
Memory IC Type EEPROM
Memory Width 16
Number of Functions 1
Number of Terminals 8
Number of Words 256 words
Number of Words Code 256
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 256X16
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Seated Height-Max 4.5 mm
Serial Bus Type MICROWIRE
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 1.8 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm
Base Number Matches 1 2

Compare S-93C66ADP-P with alternatives