SLE5532C
vs
SLE5532D
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Part Package Code |
DIE
|
DIE
|
| Package Description |
Die, Die Or Chip
|
Die, Die Or Chip
|
| Reach Compliance Code |
Compliant
|
Compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Data Retention Time-Min |
10
|
10
|
| Endurance |
100000 Write/Erase Cycles
|
100000 Write/Erase Cycles
|
| JESD-30 Code |
R-XUUC-N
|
R-XUUC-N
|
| Memory Density |
2048 Bit
|
2048 Bit
|
| Memory IC Type |
Eeprom
|
Eeprom
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Words |
256 Words
|
256 Words
|
| Number of Words Code |
256
|
256
|
| Operating Mode |
Synchronous
|
Synchronous
|
| Operating Temperature-Max |
80 °C
|
80 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
256x8
|
256x8
|
| Package Body Material |
Unspecified
|
Unspecified
|
| Package Code |
DIE
|
DIE
|
| Package Equivalence Code |
DIE OR CHIP
|
DIE OR CHIP
|
| Package Shape |
Rectangular
|
Rectangular
|
| Package Style |
Uncased Chip
|
Uncased Chip
|
| Parallel/Serial |
Serial
|
Serial
|
| Programming Voltage |
5 V
|
5 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
Yes
|
Yes
|
| Technology |
Cmos
|
Cmos
|
| Temperature Grade |
Other
|
Other
|
| Terminal Form |
No Lead
|
No Lead
|
| Terminal Position |
Upper
|
Upper
|
| Write Cycle Time-Max (tWC) |
5 Ms
|
5 Ms
|
| Write Protection |
Software
|
Software
|
| Base Number Matches |
1
|
1
|
|
|
|