ST24164B3
vs
BR24L256FV-WE2
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
ROHM CO LTD
|
| Part Package Code |
DIP
|
SOIC
|
| Package Description |
DIP, DIP8,.3
|
LSSOP,
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Additional Feature |
1000000 ERASE/WRITE CYCLES; DATA RETENTION 40 YEARS
|
|
| Clock Frequency-Max (fCLK) |
0.1 MHz
|
0.4 MHz
|
| Data Retention Time-Min |
40
|
|
| Endurance |
1000000 Write/Erase Cycles
|
|
| I2C Control Byte |
1DDDMMMR
|
|
| JESD-30 Code |
R-PDIP-T8
|
R-PDSO-G8
|
| JESD-609 Code |
e0
|
|
| Length |
9.55 mm
|
4.4 mm
|
| Memory Density |
16384 bit
|
262144 bit
|
| Memory IC Type |
EEPROM
|
EEPROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
2048 words
|
32768 words
|
| Number of Words Code |
2000
|
32000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
2KX8
|
32KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
LSSOP
|
| Package Equivalence Code |
DIP8,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.9 mm
|
1.5 mm
|
| Serial Bus Type |
I2C
|
I2C
|
| Standby Current-Max |
0.0001 A
|
|
| Supply Current-Max |
0.002 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
1.8 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
2.5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
PURE TIN
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
3 mm
|
| Write Cycle Time-Max (tWC) |
10 ms
|
5 ms
|
| Write Protection |
HARDWARE
|
|
| Base Number Matches |
1
|
1
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
10
|
|
|
|
Compare ST24164B3 with alternatives
Compare BR24L256FV-WE2 with alternatives