TC58DVM92A1FT00 vs NAND512W3B3BN1F feature comparison

TC58DVM92A1FT00 Toshiba America Electronic Components

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NAND512W3B3BN1F STMicroelectronics

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Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TOSHIBA CORP STMICROELECTRONICS
Part Package Code TSOP1 TSOP
Package Description 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48 TSOP1,
Pin Count 48 48
Reach Compliance Code unknown compliant
Samacsys Manufacturer Toshiba
JESD-30 Code R-PDSO-G48 R-PDSO-G48
JESD-609 Code e0 e3
Length 18.4 mm 18.4 mm
Memory Density 512753664 bit 536870912 bit
Memory IC Type EEPROM FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 67108864 words 67108864 words
Number of Words Code 64000000 64000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 64MX8 64MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial SERIAL PARALLEL
Peak Reflow Temperature (Cel) 240
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 12 mm 12 mm
Base Number Matches 1 1
ECCN Code EAR99
HTS Code 8542.32.00.51
Access Time-Max 35 ns

Compare TC58DVM92A1FT00 with alternatives

Compare NAND512W3B3BN1F with alternatives