TH58NVG1S3AFT05 vs NAND02GW4B2BN1F feature comparison

TH58NVG1S3AFT05 Toshiba America Electronic Components

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NAND02GW4B2BN1F Micron Technology Inc

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP MICRON TECHNOLOGY INC
Part Package Code TSOP1 TSOP
Package Description TSOP1, TSSOP48,.8,20 TSSOP,
Pin Count 48 48
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.1.B.1 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 45 ns
Command User Interface YES
Data Polling NO
JESD-30 Code R-PDSO-G48 R-PDSO-G48
JESD-609 Code e0 e3
Length 18.4 mm 18.4 mm
Memory Density 2147483648 bit 2147483648 bit
Memory IC Type EEPROM FLASH
Memory Width 8 16
Number of Functions 1 1
Number of Sectors/Size 2K
Number of Terminals 48 48
Number of Words 268435456 words 134217728 words
Number of Words Code 256000000 128000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256MX8 128MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 TSSOP
Package Equivalence Code TSSOP48,.8,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Page Size 2K words
Parallel/Serial SERIAL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified
Ready/Busy YES
Seated Height-Max 1.2 mm 1.2 mm
Sector Size 128K
Standby Current-Max 0.00005 A
Supply Current-Max 0.03 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Toggle Bit NO
Type NAND TYPE
Width 12 mm 12 mm
Base Number Matches 1 1
Pbfree Code Yes

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