TJA1050U vs SN65LBC031QD feature comparison

TJA1050U NXP Semiconductors

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SN65LBC031QD Texas Instruments

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS TEXAS INSTRUMENTS INC
Part Package Code DIE SOIC
Package Description DIE, PLASTIC, SOP-8
Pin Count 8 8
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-XUUC-N8 R-PDSO-G8
JESD-609 Code e4 e4
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIE SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Telecom IC Type INTERFACE CIRCUIT INTERFACE CIRCUIT
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD
Terminal Form NO LEAD GULL WING
Terminal Position UPPER DUAL
Base Number Matches 4 4
Pbfree Code Yes
ECCN Code EAR99
Samacsys Manufacturer Texas Instruments
Data Rate 1000 Mbps
Length 4.9 mm
Moisture Sensitivity Level 1
Number of Channels 1
Number of Transceivers 1
Package Equivalence Code SOP8,.25
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.75 mm
Supply Current-Max 0.08 mA
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm

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