TNETV2685ZUT7
vs
TNETV2685FIDZUT7
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Package Description |
FBGA,
|
FBGA,
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
14
|
14
|
| Barrel Shifter |
NO
|
NO
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
720 MHz
|
720 MHz
|
| External Data Bus Width |
32
|
32
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
| JESD-30 Code |
S-PBGA-B520
|
S-PBGA-B520
|
| JESD-609 Code |
e1
|
e1
|
| Length |
19 mm
|
19 mm
|
| Low Power Mode |
YES
|
YES
|
| Moisture Sensitivity Level |
4
|
4
|
| Number of Terminals |
520
|
520
|
| Operating Temperature-Max |
90 °C
|
90 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
FBGA
|
FBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, FINE PITCH
|
GRID ARRAY, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
245
|
245
|
| Seated Height-Max |
3.3 mm
|
3.3 mm
|
| Supply Voltage-Max |
1.26 V
|
1.26 V
|
| Supply Voltage-Min |
1.14 V
|
1.14 V
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
19 mm
|
19 mm
|
| uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, OTHER
|
DIGITAL SIGNAL PROCESSOR, OTHER
|
| Base Number Matches |
1
|
1
|
| Samacsys Manufacturer |
|
Texas Instruments
|
|
|
|
Compare TNETV2685ZUT7 with alternatives
Compare TNETV2685FIDZUT7 with alternatives