TS80C52X2-ELBR
vs
TS80C32X2-MIBR
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ATMEL CORP
|
ATMEL CORP
|
| Part Package Code |
LCC
|
|
| Package Description |
QCCJ,
|
PLASTIC, LCC-44
|
| Pin Count |
44
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
|
| Has ADC |
NO
|
NO
|
| Address Bus Width |
16
|
16
|
| Bit Size |
8
|
8
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
8
|
8
|
| JESD-30 Code |
S-PQCC-J44
|
S-PQCC-J44
|
| JESD-609 Code |
e3
|
e0
|
| Length |
16.6 mm
|
16.5862 mm
|
| Moisture Sensitivity Level |
2
|
2
|
| Number of I/O Lines |
32
|
32
|
| Number of Terminals |
44
|
44
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| PWM Channels |
NO
|
NO
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
245
|
225
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| ROM Programmability |
MROM
|
|
| Seated Height-Max |
4.57 mm
|
4.57 mm
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
16.6 mm
|
16.5862 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
2
|
| CPU Family |
|
8051
|
| Clock Frequency-Max |
|
40 MHz
|
| Package Equivalence Code |
|
LDCC44,.7SQ
|
| RAM (bytes) |
|
256
|
| Speed |
|
40 MHz
|
| Supply Current-Max |
|
39 mA
|
| Supply Voltage-Max |
|
5.5 V
|
| Supply Voltage-Min |
|
4.5 V
|
| Supply Voltage-Nom |
|
5 V
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare TS80C52X2-ELBR with alternatives
Compare TS80C32X2-MIBR with alternatives