W25Q16DVSNIG vs IS25LQ016B-JHLE1 feature comparison

W25Q16DVSNIG Winbond Electronics Corp

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IS25LQ016B-JHLE1 Integrated Silicon Solution Inc

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Rohs Code Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer WINBOND ELECTRONICS CORP INTEGRATED SILICON SOLUTION INC
Package Description SOIC-8 TBGA,
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Samacsys Manufacturer Winbond
Clock Frequency-Max (fCLK) 104 MHz 104 MHz
Data Retention Time-Min 20
Endurance 100000 Write/Erase Cycles 100000 Write/Erase Cycles
JESD-30 Code R-PDSO-G8 R-PBGA-B24
Length 5 mm 8 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 24
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2MX8 2MX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP TBGA
Package Equivalence Code SOP8,.25 BGA24,4X6,40
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE GRID ARRAY, THIN PROFILE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Programming Voltage 3 V 3 V
Qualification Status Not Qualified
Seated Height-Max 1.75 mm 1.2 mm
Serial Bus Type SPI QSPI
Standby Current-Max 0.000005 A
Supply Current-Max 0.025 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.3 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING BALL
Terminal Pitch 1.27 mm 1 mm
Terminal Position DUAL BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Type NOR TYPE NOR TYPE
Width 4 mm 6 mm
Write Protection HARDWARE/SOFTWARE HARDWARE/SOFTWARE
Base Number Matches 1 1

Compare W25Q16DVSNIG with alternatives

Compare IS25LQ016B-JHLE1 with alternatives