W25Q80BVZPJP vs XC17512LPD8C feature comparison

W25Q80BVZPJP Winbond Electronics Corp

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XC17512LPD8C AMD Xilinx

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP XILINX INC
Package Description HVSON, PLASTIC, DIP-8
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 104 MHz 15 MHz
JESD-30 Code R-PDSO-N8 R-PDIP-T8
Length 6 mm 9.3599 mm
Memory Density 8388608 bit 524288 bit
Memory IC Type FLASH CONFIGURATION MEMORY
Memory Width 8 1
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 1048576 words 524288 words
Number of Words Code 1000000 512000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 105 °C 70 °C
Operating Temperature-Min -40 °C
Organization 1MX8 512KX1
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVSON DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE IN-LINE
Parallel/Serial SERIAL SERIAL
Programming Voltage 3 V
Screening Level AEC-Q100
Seated Height-Max 0.8 mm 4.5974 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 3 V
Supply Voltage-Nom (Vsup) 3 V 3.3 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form NO LEAD THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 5 mm 7.62 mm
Base Number Matches 1 2
Pbfree Code No
Rohs Code No
Part Package Code DIP
Pin Count 8
Additional Feature USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
I/O Type COMMON
JESD-609 Code e0
Moisture Sensitivity Level 1
Package Equivalence Code DIP8,.3
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified
Standby Current-Max 0.00005 A
Supply Current-Max 0.005 mA
Terminal Finish Tin/Lead (Sn85Pb15)
Time@Peak Reflow Temperature-Max (s) 30

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