W27C512-45Z vs 5962-8751414XC feature comparison

W27C512-45Z Winbond Electronics Corp

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5962-8751414XC Atmel Corporation

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Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP ATMEL CORP
Part Package Code DIP DIP
Package Description 0.600 INCH, LEAD FREE, PLASTIC, DIP-28 DIP,
Pin Count 28 28
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.1.B.2 3A001.A.2.C
HTS Code 8542.32.00.51 8542.32.00.51
Samacsys Manufacturer Winbond
Access Time-Max 45 ns 300 ns
JESD-30 Code R-PDIP-T28 R-GDIP-T28
Length 37.08 mm 37.25 mm
Memory Density 524288 bit 65536 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 65536 words 8192 words
Number of Words Code 64000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 64KX8 8KX8
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 12 V 5 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.33 mm 5.72 mm
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15.24 mm 15.24 mm
Base Number Matches 1 1
Additional Feature AUTOMATIC WRITE; WITH READY/BUSY SIGNAL
JESD-609 Code e0
Terminal Finish TIN LEAD

Compare W27C512-45Z with alternatives

Compare 5962-8751414XC with alternatives