W27C512-45Z
vs
LH28F800SGHB-L10
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
WINBOND ELECTRONICS CORP
|
SHARP CORP
|
| Part Package Code |
DIP
|
|
| Package Description |
0.600 INCH, LEAD FREE, PLASTIC, DIP-28
|
8 X 8 MM, FBGA-48
|
| Pin Count |
28
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.B.1.B.2
|
|
| HTS Code |
8542.32.00.51
|
|
| Samacsys Manufacturer |
Winbond
|
|
| Access Time-Max |
45 ns
|
100 ns
|
| JESD-30 Code |
R-PDIP-T28
|
S-PBGA-B48
|
| Length |
37.08 mm
|
8 mm
|
| Memory Density |
524288 bit
|
8388608 bit
|
| Memory IC Type |
EEPROM
|
FLASH
|
| Memory Width |
8
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
48
|
| Number of Words |
65536 words
|
524288 words
|
| Number of Words Code |
64000
|
512000
|
| Operating Mode |
ASYNCHRONOUS
|
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
64KX8
|
512KX16
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
TFBGA
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Parallel/Serial |
PARALLEL
|
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Programming Voltage |
12 V
|
3.3 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.33 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Form |
THROUGH-HOLE
|
BALL
|
| Terminal Pitch |
2.54 mm
|
0.8 mm
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
15.24 mm
|
8 mm
|
| Base Number Matches |
1
|
2
|
| Type |
|
NOR TYPE
|
|
|
|
Compare W27C512-45Z with alternatives
Compare LH28F800SGHB-L10 with alternatives