W27C512-45Z vs WMF512K8-120FEC5 feature comparison

W27C512-45Z Winbond Electronics Corp

Buy Now Datasheet

WMF512K8-120FEC5 Mercury Systems Inc

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer WINBOND ELECTRONICS CORP MERCURY SYSTEMS INC
Part Package Code DIP
Package Description 0.600 INCH, LEAD FREE, PLASTIC, DIP-28 DFP-32
Pin Count 28
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.1.B.2 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Samacsys Manufacturer Winbond
Access Time-Max 45 ns 120 ns
JESD-30 Code R-PDIP-T28 R-CDFP-F32
Length 37.08 mm 20.83 mm
Memory Density 524288 bit 4194304 bit
Memory IC Type EEPROM FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 32
Number of Words 65536 words 524288 words
Number of Words Code 64000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 64KX8 512KX8
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP DFP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE FLATPACK
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 12 V 5 V
Qualification Status Not Qualified
Seated Height-Max 5.33 mm 2.777 mm
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form THROUGH-HOLE FLAT
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15.24 mm 10.41 mm
Base Number Matches 1 2
Additional Feature SECTOR ERASE; 10000 ERASE/PROGRAM CYCLES MIN
Supply Current-Max 0.035 mA
Type NOR TYPE

Compare W27C512-45Z with alternatives

Compare WMF512K8-120FEC5 with alternatives