W27L010P-12 vs AM28F010-150DI feature comparison

W27L010P-12 Winbond Electronics Corp

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AM28F010-150DI Rochester Electronics LLC

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Rohs Code No
Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer WINBOND ELECTRONICS CORP ROCHESTER ELECTRONICS LLC
Part Package Code QFJ
Package Description QCCJ, LDCC32,.5X.6 DIP,
Pin Count 32
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 120 ns 150 ns
Additional Feature TTL/CMOS COMPATIBLE INPUT & OUTPUT BULK ERASE
Command User Interface NO
Data Polling NO
JESD-30 Code R-PQCC-J32 R-GDIP-T32
JESD-609 Code e0
Length 13.97 mm 42.1005 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type EEPROM FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 128KX8 128KX8
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code QCCJ DIP
Package Equivalence Code LDCC32,.5X.6
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER IN-LINE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 12 V 12 V
Qualification Status Not Qualified
Seated Height-Max 3.56 mm 5.588 mm
Standby Current-Max 0.00002 A
Supply Current-Max 0.01 mA
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 3 V 4.5 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form J BEND THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position QUAD DUAL
Toggle Bit NO
Width 11.43 mm 15.24 mm
Base Number Matches 1 1
Type NOR TYPE

Compare W27L010P-12 with alternatives

Compare AM28F010-150DI with alternatives