W27L010P-12 vs AM28F010-200C3LI feature comparison

W27L010P-12 Winbond Electronics Corp

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AM28F010-200C3LI Rochester Electronics LLC

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Rohs Code No
Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer WINBOND ELECTRONICS CORP ROCHESTER ELECTRONICS LLC
Part Package Code QFJ
Package Description QCCJ, LDCC32,.5X.6 ,
Pin Count 32
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 120 ns
Additional Feature TTL/CMOS COMPATIBLE INPUT & OUTPUT
Command User Interface NO
Data Polling NO
JESD-30 Code R-PQCC-J32
JESD-609 Code e0
Length 13.97 mm
Memory Density 1048576 bit
Memory IC Type EEPROM FLASH
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 131072 words
Number of Words Code 128000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 128KX8
Package Body Material PLASTIC/EPOXY
Package Code QCCJ
Package Equivalence Code LDCC32,.5X.6
Package Shape RECTANGULAR
Package Style CHIP CARRIER
Parallel/Serial PARALLEL
Programming Voltage 12 V 12 V
Qualification Status Not Qualified
Seated Height-Max 3.56 mm
Standby Current-Max 0.00002 A
Supply Current-Max 0.01 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form J BEND
Terminal Pitch 1.27 mm
Terminal Position QUAD
Toggle Bit NO
Width 11.43 mm
Base Number Matches 1 2

Compare W27L010P-12 with alternatives

Compare AM28F010-200C3LI with alternatives