W27L010P-12 vs M27C4001-70XB6 feature comparison

W27L010P-12 Winbond Electronics Corp

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M27C4001-70XB6 STMicroelectronics

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP STMICROELECTRONICS
Part Package Code QFJ DIP
Package Description QCCJ, LDCC32,.5X.6 DIP, DIP32,.6
Pin Count 32 32
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.71
Access Time-Max 120 ns 70 ns
Additional Feature TTL/CMOS COMPATIBLE INPUT & OUTPUT
Command User Interface NO
Data Polling NO
JESD-30 Code R-PQCC-J32 R-PDIP-T32
JESD-609 Code e0 e3
Length 13.97 mm 42.035 mm
Memory Density 1048576 bit 4194304 bit
Memory IC Type EEPROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 524288 words
Number of Words Code 128000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 128KX8 512KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ DIP
Package Equivalence Code LDCC32,.5X.6 DIP32,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER IN-LINE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 12 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.56 mm 4.83 mm
Standby Current-Max 0.00002 A 0.0001 A
Supply Current-Max 0.01 mA 0.03 mA
Supply Voltage-Max (Vsup) 3.6 V 5.25 V
Supply Voltage-Min (Vsup) 3 V 4.75 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form J BEND THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position QUAD DUAL
Toggle Bit NO
Width 11.43 mm 15.24 mm
Base Number Matches 1 2
I/O Type COMMON
Output Characteristics 3-STATE

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