W29F102Q-45 vs M29F102BB45N1E feature comparison

W29F102Q-45 Winbond Electronics Corp

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M29F102BB45N1E Numonyx Memory Solutions

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP NUMONYX
Part Package Code TSOP TSOP
Package Description TSOP1, 10 X 14 MM, LEAD FREE, PLASTIC, TSOP-40
Pin Count 40 40
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 45 ns 45 ns
Additional Feature HARDWARE DATA PROTECTION; 10 YEARS DATA RETENTION BOTTOM BOOT BLOCK
Data Retention Time-Min 10
JESD-30 Code R-PDSO-G40 R-PDSO-G40
Length 12.4 mm 12.4 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 40 40
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 64KX16 64KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 5 V 5 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Type NOR TYPE NOR TYPE
Width 10 mm 10 mm
Base Number Matches 2 1
Boot Block BOTTOM
JESD-609 Code e3/e6
Peak Reflow Temperature (Cel) 260
Terminal Finish MATTE TIN/TIN BISMUTH
Time@Peak Reflow Temperature-Max (s) 40

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Compare M29F102BB45N1E with alternatives