W3J128M72G-1066PBI vs W3J128M72G-1066PBM feature comparison

W3J128M72G-1066PBI Microsemi Corporation

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W3J128M72G-1066PBM Mercury Systems Inc

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP MERCURY SYSTEMS INC
Part Package Code BGA
Package Description 20.50 X 21.50 MM, 1 MM PITCH, PLASTIC, BGA-375 BGA, BGA375(UNSPEC)
Pin Count 375
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.36 8542.32.00.36
Access Mode SINGLE BANK PAGE BURST SINGLE BANK PAGE BURST
Additional Feature AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED AUTO/SELF REFRESH
JESD-30 Code R-PBGA-B375 R-PBGA-B375
Length 21.75 mm
Memory Density 9663676416 bit 8589934592 bit
Memory IC Type DDR DRAM DDR3 DRAM
Memory Width 72 72
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 375 375
Number of Words 134217728 words 134217728 words
Number of Words Code 128000000 128000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 128MX72 128MX72
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 6 mm
Self Refresh YES YES
Supply Voltage-Max (Vsup) 1.575 V
Supply Voltage-Min (Vsup) 1.425 V
Supply Voltage-Nom (Vsup) 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form BALL BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 20.75 mm
Base Number Matches 5 1
Interleaved Burst Length 8
JESD-609 Code e0
Package Equivalence Code BGA375(UNSPEC)
Reverse Pinout NO
Sequential Burst Length 8
Terminal Finish Tin/Lead (Sn/Pb)

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