W948D6KBHX5I vs MT46H8M16LFBF-54IT:K feature comparison

W948D6KBHX5I Winbond Electronics Corp

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MT46H8M16LFBF-54IT:K Micron Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer WINBOND ELECTRONICS CORP MICRON TECHNOLOGY INC
Package Description VFBGA-60 VFBGA,
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.24 8542.32.00.02
Date Of Intro 2017-05-25
Samacsys Manufacturer Winbond
Access Mode FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Access Time-Max 5 ns 5 ns
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 Code R-PBGA-B60 R-PBGA-B60
Length 9 mm 9 mm
Memory Density 268435456 bit 134217728 bit
Memory IC Type DDR1 DRAM DDR1 DRAM
Memory Width 16 16
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 60 60
Number of Words 16777216 words 8388608 words
Number of Words Code 16000000 8000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 16MX16 8MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA VFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Seated Height-Max 1.025 mm 1 mm
Self Refresh YES YES
Supply Voltage-Max (Vsup) 1.95 V 1.95 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 8 mm 8 mm
Base Number Matches 1 1
Pbfree Code Yes
Part Package Code BGA
Pin Count 60
JESD-609 Code e1
Qualification Status Not Qualified
Terminal Finish TIN SILVER COPPER

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