WS57C256F-35D vs HY27UH08AG5BTC feature comparison

WS57C256F-35D Waferscale Integration Inc

Buy Now Datasheet

HY27UH08AG5BTC SK Hynix Inc

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WAFERSCALE INTEGRATION INC SK HYNIX INC
Package Description 0.600 INCH, CERDIP-28 TSOP1,
Reach Compliance Code unknown unknown
Access Time-Max 35 ns
I/O Type COMMON
JESD-30 Code R-GDIP-T28 R-PDSO-G48
JESD-609 Code e0
Memory Density 262144 bit 17179869184 bit
Memory IC Type UVPROM FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 48
Number of Words 32768 words 2147483648 words
Number of Words Code 32000 2000000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 32KX8 2GX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP TSOP1
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Parallel/Serial PARALLEL SERIAL
Programming Voltage 12.5 V 3.3 V
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.0005 A
Supply Current-Max 0.164 mA
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 4.5 V 2.7 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.5 mm
Terminal Position DUAL DUAL
Base Number Matches 2 1
Part Package Code TSOP1
Pin Count 48
ECCN Code EAR99
HTS Code 8542.32.00.51
Length 18.4 mm
Seated Height-Max 1.2 mm
Type SLC NAND TYPE
Width 12 mm

Compare WS57C256F-35D with alternatives

Compare HY27UH08AG5BTC with alternatives