WS57C256F-35D
vs
HY27UH08AG5BTC
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
WAFERSCALE INTEGRATION INC
|
SK HYNIX INC
|
Package Description |
0.600 INCH, CERDIP-28
|
TSOP1,
|
Reach Compliance Code |
unknown
|
unknown
|
Access Time-Max |
35 ns
|
|
I/O Type |
COMMON
|
|
JESD-30 Code |
R-GDIP-T28
|
R-PDSO-G48
|
JESD-609 Code |
e0
|
|
Memory Density |
262144 bit
|
17179869184 bit
|
Memory IC Type |
UVPROM
|
FLASH
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
48
|
Number of Words |
32768 words
|
2147483648 words
|
Number of Words Code |
32000
|
2000000000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
32KX8
|
2GX8
|
Output Characteristics |
3-STATE
|
|
Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
TSOP1
|
Package Equivalence Code |
DIP28,.6
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
SMALL OUTLINE
|
Parallel/Serial |
PARALLEL
|
SERIAL
|
Programming Voltage |
12.5 V
|
3.3 V
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Standby Current-Max |
0.0005 A
|
|
Supply Current-Max |
0.164 mA
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
2.7 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
3.3 V
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
Terminal Form |
THROUGH-HOLE
|
GULL WING
|
Terminal Pitch |
2.54 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
2
|
1
|
Part Package Code |
|
TSOP1
|
Pin Count |
|
48
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.32.00.51
|
Length |
|
18.4 mm
|
Seated Height-Max |
|
1.2 mm
|
Type |
|
SLC NAND TYPE
|
Width |
|
12 mm
|
|
|
|
Compare WS57C256F-35D with alternatives
Compare HY27UH08AG5BTC with alternatives