X24C00PG vs X24C00P-3 feature comparison

X24C00PG IC Microsystems Sdn Bhd

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X24C00P-3 Xicor Inc

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer IC MICROSYSTEMS SDN BHD XICOR INC
Part Package Code DIP
Package Description DIP, PLASTIC, DIP-8
Pin Count 8
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.32.00.51
Clock Frequency-Max (fCLK) 1 MHz 1 MHz
JESD-30 Code R-PDIP-T8 R-PDIP-T8
Length 10.03 mm 10.03 mm
Memory Density 128 bit 128 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 16 words 16 words
Number of Words Code 16 16
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 16X8 16X8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.32 mm 4.32 mm
Serial Bus Type I2C I2C
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Write Cycle Time-Max (tWC) 5 ms 5 ms
Base Number Matches 3 1
Additional Feature 2 WIRE SERIAL INTERFACE
Data Retention Time-Min 100
Endurance 100000 Write/Erase Cycles
JESD-609 Code e0
Output Characteristics 3-STATE
Package Equivalence Code DIP8,.3
Supply Current-Max 0.003 mA
Terminal Finish TIN LEAD

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