X24C01APIG-3 vs X24C01API-3 feature comparison

X24C01APIG-3 IC Microsystems Sdn Bhd

Buy Now Datasheet

X24C01API-3 IC Microsystems Sdn Bhd

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer IC MICROSYSTEMS SDN BHD IC MICROSYSTEMS SDN BHD
Part Package Code DIP DIP
Package Description DIP, DIP, DIP8,.3
Pin Count 8 8
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 0.1 MHz 0.1 MHz
JESD-30 Code R-PDIP-T8 R-PDIP-T8
Length 10.03 mm 10.03 mm
Memory Density 1024 bit 1024 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 128 words 128 words
Number of Words Code 128 128
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 128X8 128X8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED 240
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.32 mm 4.32 mm
Serial Bus Type I2C I2C
Supply Voltage-Max (Vsup) 3.63 V 3.63 V
Supply Voltage-Min (Vsup) 2.97 V 2.97 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 7.62 mm
Write Cycle Time-Max (tWC) 10 ms 10 ms
Base Number Matches 1 2
Data Retention Time-Min 100
Endurance 100000 Write/Erase Cycles
I2C Control Byte 1010DDDR
JESD-609 Code e0
Moisture Sensitivity Level 3
Package Equivalence Code DIP8,.3
Standby Current-Max 0.00003 A
Supply Current-Max 0.002 mA
Terminal Finish TIN LEAD
Write Protection HARDWARE

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