XC17256ELPC20C vs XC17256EPCG20I feature comparison

XC17256ELPC20C Rochester Electronics LLC

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XC17256EPCG20I AMD Xilinx

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC XILINX INC
Part Package Code QLCC QLCC
Package Description PLASTIC, LCC-20 QCCJ,
Pin Count 20 20
Reach Compliance Code unknown compliant
Additional Feature USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
JESD-30 Code S-PQCC-J20 S-PQCC-J20
JESD-609 Code e0 e3
Length 8.9662 mm 8.9662 mm
Memory Density 262144 bit 262144 bit
Memory IC Type CONFIGURATION MEMORY CONFIGURATION MEMORY
Memory Width 1 1
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 20 20
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 256KX1 256KX1
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 225 260
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 4.572 mm 4.572 mm
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 3 V 4.5 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD Matte Tin (Sn)
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 40
Width 8.9662 mm 8.9662 mm
Base Number Matches 2 1
ECCN Code EAR99
HTS Code 8542.32.00.51
Output Characteristics 3-STATE

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