XC17S150APD8C
vs
BR24C21-E2
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
XILINX INC
|
ROHM CO LTD
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
PLASTIC, DIP-8
|
,
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.61
|
8542.32.00.51
|
| I/O Type |
COMMON
|
|
| JESD-30 Code |
R-PDIP-T8
|
R-PDIP-T8
|
| JESD-609 Code |
e0
|
|
| Length |
9.3599 mm
|
|
| Memory Density |
1040096 bit
|
|
| Memory IC Type |
CONFIGURATION MEMORY
|
EEPROM
|
| Memory Width |
1
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
8
|
8
|
| Number of Words |
1040096 words
|
|
| Number of Words Code |
1040096
|
|
| Operating Mode |
SYNCHRONOUS
|
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Organization |
1040096X1
|
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
|
| Package Equivalence Code |
DIP8,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Parallel/Serial |
SERIAL
|
|
| Peak Reflow Temperature (Cel) |
225
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.5974 mm
|
|
| Standby Current-Max |
0.00005 A
|
|
| Supply Current-Max |
0.005 mA
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
|
| Supply Voltage-Min (Vsup) |
3 V
|
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
Tin/Lead (Sn85Pb15)
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
7.62 mm
|
|
| Base Number Matches |
1
|
1
|
| Serial Bus Type |
|
I2C
|
|
|
|
Compare XC17S150APD8C with alternatives
Compare BR24C21-E2 with alternatives