XCF02SVOG20C0936 vs XCF02SVO20CES feature comparison

XCF02SVOG20C0936 AMD Xilinx

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XCF02SVO20CES AMD Xilinx

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code TSSOP TSSOP
Package Description LEAD FREE, PLASTIC, TSSOP-20 TSSOP,
Pin Count 20 20
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.1.B.1 3A991.B.1.B.1
HTS Code 8542.32.00.51 8542.32.00.51
JESD-30 Code R-PDSO-G20 R-PDSO-G20
JESD-609 Code e3 e0
Length 6.5024 mm 6.5024 mm
Memory Density 2097152 bit 2097152 bit
Memory IC Type CONFIGURATION MEMORY CONFIGURATION MEMORY
Memory Width 1 1
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 20 20
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2MX1 2MX1
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.19 mm 1.19 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Matte Tin (Sn) TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 4.4 mm 4.4 mm
Base Number Matches 1 1

Compare XCF02SVOG20C0936 with alternatives

Compare XCF02SVO20CES with alternatives