XCF16PFS48C
vs
XCF16PFSG48C
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
Plastic, Tfbga-48
|
Lead-Free, Plastic, Tfbga-48
|
| Pin Count |
48
|
48
|
| Reach Compliance Code |
Not Compliant
|
Compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Clock Frequency-Max (fCLK) |
33 Mhz
|
33 Mhz
|
| Data Retention Time-Min |
20
|
20
|
| Endurance |
20000 Write/Erase Cycles
|
20000 Write/Erase Cycles
|
| JESD-30 Code |
R-PBGA-B48
|
R-PBGA-B48
|
| JESD-609 Code |
e0
|
e2
|
| Length |
9 Mm
|
9 Mm
|
| Memory Density |
16777216 Bit
|
16777216 Bit
|
| Memory IC Type |
Configuration Memory
|
Configuration Memory
|
| Memory Width |
8
|
8
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
48
|
48
|
| Number of Words |
2097152 Words
|
2097152 Words
|
| Number of Words Code |
2000000
|
2000000
|
| Operating Mode |
Synchronous
|
Synchronous
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
2mx8
|
2mx8
|
| Output Characteristics |
3-State
|
3-State
|
| Package Body Material |
Plastic/Epoxy
|
Plastic/Epoxy
|
| Package Code |
TFBGA
|
TFBGA
|
| Package Equivalence Code |
BGA48,6X8,32
|
BGA48,6X8,32
|
| Package Shape |
Rectangular
|
Rectangular
|
| Package Style |
Grid Array, Thin Profile, Fine Pitch
|
Grid Array, Thin Profile, Fine Pitch
|
| Parallel/Serial |
Serial
|
Serial
|
| Peak Reflow Temperature (Cel) |
240
|
260
|
| Programming Voltage |
1.8 V
|
1.8 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 Mm
|
1.2 Mm
|
| Standby Current-Max |
0.001 A
|
0.001 A
|
| Supply Current-Max |
0.01 Ma
|
0.01 Ma
|
| Supply Voltage-Max (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Min (Vsup) |
1.65 V
|
1.65 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
| Surface Mount |
Yes
|
Yes
|
| Technology |
Cmos
|
Cmos
|
| Temperature Grade |
Industrial
|
Industrial
|
| Terminal Finish |
Tin Lead
|
Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
|
| Terminal Form |
Ball
|
Ball
|
| Terminal Pitch |
0.8 Mm
|
0.8 Mm
|
| Terminal Position |
Bottom
|
Bottom
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Type |
Nor Type
|
Nor Type
|
| Width |
8 Mm
|
8 Mm
|
| Write Protection |
Hardware
|
Hardware
|
| Base Number Matches |
1
|
1
|
|
|
|