Part Details for 53S281N by AMD
Overview of 53S281N by AMD
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Space Technology
Industrial Automation
Computing and Data Storage
Aerospace and Defense
Part Details for 53S281N
53S281N CAD Models
53S281N Part Data Attributes:
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53S281N
AMD
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Datasheet
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53S281N
AMD
OTP ROM, 256X8, 50ns, Bipolar, PDIP24, PLASTIC, DIP-24
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Part Package Code | DIP | |
| Package Description | DIP, | |
| Pin Count | 24 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 50 ns | |
| JESD-30 Code | R-PDIP-T24 | |
| Length | 32.004 mm | |
| Memory Density | 2048 bit | |
| Memory IC Type | OTP ROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 256 words | |
| Number of Words Code | 256 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 256X8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.715 mm | |
| Supply Current-Max | 0.14 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | BIPOLAR | |
| Temperature Grade | MILITARY | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for 53S281N
This table gives cross-reference parts and alternative options found for 53S281N. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 53S281N, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| N82S114I | 256X8 OTPROM, 60ns, CDIP24 | Philips Semiconductors | 53S281N vs N82S114I |
| AM9702A-2HDL | UVPROM, 256X8, 650ns, MOS, CDIP24, HERMETIC SEALED, WINDOWED, CERDIP-24 | AMD | 53S281N vs AM9702A-2HDL |
| N82S114I | IC 256 X 8 OTPROM, 60 ns, CDIP24, Programmable ROM | NXP Semiconductors | 53S281N vs N82S114I |
| N82S214I | OTP ROM, 256X8, 60ns, Bipolar, CDIP24 | Signetics | 53S281N vs N82S214I |
| AM1702AL | UVPROM, 256X8, 1000ns, MOS, CDIP24, HERMETIC SEALED, WINDOWED, CERDIP-24 | AMD | 53S281N vs AM1702AL |
| AM1702AL-1 | UVPROM, 256X8, 550ns, MOS, CDIP24, HERMETIC SEALED, WINDOWED, CERDIP-24 | AMD | 53S281N vs AM1702AL-1 |
| AM1702A-2 | UVPROM, 256X8, 650ns, MOS, CDIP24, HERMETIC SEALED, WINDOWED, CERDIP-24 | AMD | 53S281N vs AM1702A-2 |
| AM9702ALHDL | UVPROM, 256X8, 1000ns, MOS, CDIP24, HERMETIC SEALED, WINDOWED, CERDIP-24 | AMD | 53S281N vs AM9702ALHDL |
| 53S281AN | OTP ROM, 256X8, 40ns, Bipolar, PDIP24, PLASTIC, DIP-24 | AMD | 53S281N vs 53S281AN |
| AM9702AL-1HDL | UVPROM, 256X8, 550ns, MOS, CDIP24, HERMETIC SEALED, WINDOWED, CERDIP-24 | AMD | 53S281N vs AM9702AL-1HDL |