Part Details for 5962-9309104HYA by Micross Components
Overview of 5962-9309104HYA by Micross Components
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| 5962-8672601EA | Rochester Electronics LLC | Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.875 INCH, DIP-16 | |
| 5962-8672601FA | Rochester Electronics LLC | Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.375 INCH, FP-16 | |
| 5962-87518013A | Rochester Electronics LLC | Interrupt Controller, NMOS, CQCC28, CERAMIC, LCC-28 |
Part Details for 5962-9309104HYA
5962-9309104HYA CAD Models
5962-9309104HYA Part Data Attributes
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5962-9309104HYA
Micross Components
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5962-9309104HYA
Micross Components
EEPROM Module, 512KX8, 200ns, Parallel, CMOS, DIP-32
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | AUSTIN SEMICONDUCTOR INC | |
| Part Package Code | DIP | |
| Package Description | DIP, DIP32,.6 | |
| Pin Count | 32 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 200 ns | |
| Additional Feature | AUTOMATIC WRITE | |
| Command User Interface | NO | |
| Data Polling | YES | |
| Data Retention Time-Min | 10 | |
| Endurance | 10000 Write/Erase Cycles | |
| JESD-30 Code | R-CDIP-T32 | |
| JESD-609 Code | e0 | |
| Length | 42.4 mm | |
| Memory Density | 4194304 bit | |
| Memory IC Type | EEPROM MODULE | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 512KX8 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP32,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Page Size | 128 words | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 5 V | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-PRF-38534 Class H | |
| Seated Height-Max | 6.98 mm | |
| Standby Current-Max | 0.01 A | |
| Supply Current-Max | 0.18 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Toggle Bit | NO | |
| Width | 15.24 mm | |
| Write Cycle Time-Max (tWC) | 10 ms |
Alternate Parts for 5962-9309104HYA
This table gives cross-reference parts and alternative options found for 5962-9309104HYA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-9309104HYA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 5962-9309104HXX | EEPROM Module, 512KX8, 200ns, Parallel, CMOS, CDIP32, DUAL CAVITY, SIDE BRAZED, HERMETIC SEALED, CERAMIC, DIP-32 | White Microelectronics | 5962-9309104HYA vs 5962-9309104HXX |
| WE512K8200CI | EEPROM Module, 512KX8, 200ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | Mercury Systems Inc | 5962-9309104HYA vs WE512K8200CI |
| WE512K8200CQA | EEPROM Module, 512KX8, 200ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | 5962-9309104HYA vs WE512K8200CQA |
| AT28C040-20BI | EEPROM, 512KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | Atmel Corporation | 5962-9309104HYA vs AT28C040-20BI |
| WE512K8-200CM | EEPROM Module, 512KX8, 200ns, Parallel, CMOS, CDIP32, DIP-32 | Mercury Systems Inc | 5962-9309104HYA vs WE512K8-200CM |
| WE512K8-200CI | EEPROM Module, 512KX8, 200ns, Parallel, CMOS, CDIP32, DIP-32 | Mercury Systems Inc | 5962-9309104HYA vs WE512K8-200CI |
| XM28C040MHR-20 | EEPROM Module, 512KX8, 200ns, Parallel, CMOS, CDIP32, SIDE BRAZED, CERAMIC, MODULE, DIP-32 | Xicor Inc | 5962-9309104HYA vs XM28C040MHR-20 |
| FTE512S8N-20I | EEPROM, 512KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | Force Technologies Ltd | 5962-9309104HYA vs FTE512S8N-20I |
| WE512K8200CC | EEPROM Module, 512KX8, 200ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | 5962-9309104HYA vs WE512K8200CC |
| WE512K8200CM | EEPROM Module, 512KX8, 200ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | Mercury Systems Inc | 5962-9309104HYA vs WE512K8200CM |