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Memory / SRAMs / 5962-9461105HAC
5962-9461105HAC by:

SRAM Module, 512KX32, 55ns, CMOS, CQFP68, CO-FIRED CERAMIC, QFP-68

Part Details for 5962-9461105HAC by Mercury Systems Inc

Overview of 5962-9461105HAC by Mercury Systems Inc

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Applications Education and Research Industrial Automation Aerospace and Defense Electronic Manufacturing

Available Datasheets

Part # Manufacturer Description Datasheet
5962-8672601EA Rochester Electronics LLC Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.875 INCH, DIP-16
5962-8672601FA Rochester Electronics LLC Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.375 INCH, FP-16
5962-87518013A Rochester Electronics LLC Interrupt Controller, NMOS, CQCC28, CERAMIC, LCC-28

Part Details for 5962-9461105HAC

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5962-9461105HAC Part Data Attributes

Parametric Data
5962-9461105HAC Mercury Systems Inc
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5962-9461105HAC Mercury Systems Inc SRAM Module, 512KX32, 55ns, CMOS, CQFP68, CO-FIRED CERAMIC, QFP-68
Part Life Cycle Code Contact Manufacturer
Ihs Manufacturer MERCURY SYSTEMS INC
Package Description QFP,
Reach Compliance Code compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Access Time-Max 55 ns
Additional Feature USER CONFIGURABLE AS 2M X 8
Alternate Memory Width 16
JESD-30 Code S-CQFP-G68
JESD-609 Code e4
Memory Density 16777216 bit
Memory IC Type SRAM MODULE
Memory Width 32
Number of Functions 1
Number of Terminals 68
Number of Words 524288 words
Number of Words Code 512000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 512KX32
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code QFP
Package Shape SQUARE
Package Style FLATPACK
Parallel/Serial PARALLEL
Qualification Status Qualified
Screening Level MIL-PRF-38534
Seated Height-Max 5.1 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES
Technology CMOS
Temperature Grade MILITARY
Terminal Finish GOLD
Terminal Form GULL WING
Terminal Pitch 1.27 mm
Terminal Position QUAD

Alternate Parts for 5962-9461105HAC

This table gives cross-reference parts and alternative options found for 5962-9461105HAC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-9461105HAC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
AS8S512K32Q1-55/IT SRAM Module, 512KX32, 55ns, CMOS, CQFP68, CERAMIC, QFP-68 Micross Components 5962-9461105HAC vs AS8S512K32Q1-55/IT
5962-9461111HAC SRAM Module, 512KX32, 55ns, CMOS, CQFP68, CERAMIC, QFP-68 White Electronic Designs Corp 5962-9461105HAC vs 5962-9461111HAC
AS8S512K32Q1-55/XT SRAM Module, 512KX32, 55ns, CMOS, CQFP68, CERAMIC, QFP-68 Micross Components 5962-9461105HAC vs AS8S512K32Q1-55/XT
WS512K32-55G2LIA SRAM Module, 512KX32, 55ns, CMOS, CQFP68, 22.40 X 22.40 MM, 5.08 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 Mercury Systems Inc 5962-9461105HAC vs WS512K32-55G2LIA
5962-9461105HAA SRAM Module, 512KX32, 55ns, CMOS, CQFP68, QFP-68 Micross Components 5962-9461105HAC vs 5962-9461105HAA
5962-9461105HAC SRAM Module, 512KX32, 55ns, CMOS, CQFP68, CO-FIRED CERAMIC, QFP-68 White Electronic Designs Corp 5962-9461105HAC vs 5962-9461105HAC
WS512K32-55G2LQ SRAM Module, 512KX32, 55ns, CMOS, CQFP68, 22.40 X 22.40 MM, 5.08 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 Mercury Systems Inc 5962-9461105HAC vs WS512K32-55G2LQ
AS8S512K32Q1-55/883C SRAM Module, 512KX32, 55ns, CMOS, CQFP68, CERAMIC, BQFP-68 Micross Components 5962-9461105HAC vs AS8S512K32Q1-55/883C
WS512K32-55G2LC SRAM Module, 512KX32, 55ns, CMOS, CQFP68, 22.40 X 22.40 MM, 5.08 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 Mercury Systems Inc 5962-9461105HAC vs WS512K32-55G2LC
AS8S512K32Q1-55L/883 SRAM Module, Micross Components 5962-9461105HAC vs AS8S512K32Q1-55L/883
Part Number Description Manufacturer Compare
WS128K32-45HSME SRAM Module, 512KX8, 45ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 White Electronic Designs Corp 5962-9461105HAC vs WS128K32-45HSME
CY7C194-35LC Standard SRAM, 64KX4, 35ns, CMOS, LCC-28 Cypress Semiconductor 5962-9461105HAC vs CY7C194-35LC
SMDP-65656L45 Standard SRAM, 32KX8, CMOS, CDFP28, Temic Semiconductors 5962-9461105HAC vs SMDP-65656L45
FT6264-45PCLF Standard SRAM, 8KX8, 45ns, CMOS, PDIP28, 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-28 Force Technologies Ltd 5962-9461105HAC vs FT6264-45PCLF
FT6198A-20DC Standard SRAM, 16KX4, 20ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24 Force Technologies Ltd 5962-9461105HAC vs FT6198A-20DC
WS128K32V-20G4S SRAM Module, 512KX8, 20ns, CMOS, White Electronic Designs Corp 5962-9461105HAC vs WS128K32V-20G4S
WS128K32-20G4I SRAM Module, 512KX8, 20ns, CMOS, CQFP68, 40 MM, HERMETIC SEALED, CERAMIC, QFP-68 White Electronic Designs Corp 5962-9461105HAC vs WS128K32-20G4I
MB8287-35PSK Standard SRAM, 32KX8, 35ns, CMOS, PDIP32, 0.300 INCH, SKINNY, PLASTIC, DIP-32 FUJITSU Semiconductor Limited 5962-9461105HAC vs MB8287-35PSK
WS128K32-45G2IA SRAM Module, 512KX8, 45ns, CMOS, CQFP68, 22 X 22 MM, HERMETIC SEALED, CERAMIC, QFP-68 White Electronic Designs Corp 5962-9461105HAC vs WS128K32-45G2IA
IMS1820W-35 64KX4 STANDARD SRAM, 35ns, CQCC28, CERAMIC, LCC-28 STMicroelectronics 5962-9461105HAC vs IMS1820W-35

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