Datasheets
70T633S12BFGI8 by:

512K x 18, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA0/Reel

Part Details for 70T633S12BFGI8 by Renesas Electronics Corporation

Overview of 70T633S12BFGI8 by Renesas Electronics Corporation

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Applications Space Technology Aerospace and Defense

Price & Stock for 70T633S12BFGI8

Part # Distributor Description Stock Price Buy
DISTI # 70T633S12BFGI8-ND
DigiKey IC SRAM 9MBIT PARALLEL 208CABGA Min Qty: 1000 Lead time: 18 Weeks Container: Tape & Reel (TR) Limited Supply - Call
  • 1,000 $256.7146
$256.7146 Buy Now
DISTI # 70T633S12BFGI8
Avnet Americas 512K x 18, 3.3V/2.5V Dual-Port RAM, Interleaved I/O's - Tape and Reel (Alt: 70T633S12BFGI8) RoHS: Compliant Min Qty: 1000 Package Multiple: 1000 Container: Reel 0
  • 1,000 $289.1155
  • 2,000 $283.1338
  • 4,000 $277.1521
  • 6,000 $271.1704
  • 8,000 $265.1887
  • 10,000 $259.2070
  • 100,000 $253.2253
$253.2253 / $289.1155 Buy Now
Future Electronics   RoHS: Compliant pbFree: Yes Min Qty: 1000 Package Multiple: 1000 Lead time: 36 Weeks Container: Reel 0
Reel
  • 1,000 $255.6300
$255.6300 Buy Now
Future Electronics   RoHS: Compliant pbFree: Yes Min Qty: 1000 Package Multiple: 1000 Lead time: 36 Weeks Container: Reel 0
Reel
  • 1,000 $258.9500
$258.9500 Buy Now

Part Details for 70T633S12BFGI8

70T633S12BFGI8 CAD Models

70T633S12BFGI8 Part Data Attributes

70T633S12BFGI8 Renesas Electronics Corporation
Buy Now Datasheet
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70T633S12BFGI8 Renesas Electronics Corporation 512K x 18, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA0/Reel
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code End Of Life
Ihs Manufacturer RENESAS ELECTRONICS CORP
Part Package Code CABGA
Pin Count 208
Manufacturer Package Code BFG208
Reach Compliance Code compliant
ECCN Code NLR
HTS Code 8542320041
Samacsys Manufacturer Renesas Electronics
Access Time-Max 12 ns
I/O Type COMMON
JESD-30 Code S-PBGA-B208
JESD-609 Code e1
Memory Density 9437184 bit
Memory IC Type MULTI-PORT SRAM
Memory Width 18
Moisture Sensitivity Level 3
Number of Functions 1
Number of Ports 2
Number of Terminals 208
Number of Words 524288 words
Number of Words Code 512000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 512KX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA208,17X17,32
Package Shape SQUARE
Package Style GRID ARRAY
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Standby Current-Max 0.02 A
Standby Voltage-Min 2.4 V
Supply Current-Max 0.395 mA
Supply Voltage-Max (Vsup) 2.6 V
Supply Voltage-Min (Vsup) 2.4 V
Supply Voltage-Nom (Vsup) 2.5 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30

Alternate Parts for 70T633S12BFGI8

This table gives cross-reference parts and alternative options found for 70T633S12BFGI8. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 70T633S12BFGI8, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
IDT70T633S12BFI Dual-Port SRAM, 512KX18, 12ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FBGA-208 Integrated Device Technology Inc 70T633S12BFGI8 vs IDT70T633S12BFI
70T633S12BFI CABGA-208, Tray Integrated Device Technology Inc 70T633S12BFGI8 vs 70T633S12BFI
IDT70T633S12BFGI Dual-Port SRAM, 512KX18, 12ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HIEGHT, 0.80 MM, PITCH, GREEN, FPBGA-208 Integrated Device Technology Inc 70T633S12BFGI8 vs IDT70T633S12BFGI
70T633S12BFGI8 CABGA-208, Reel Integrated Device Technology Inc 70T633S12BFGI8 vs 70T633S12BFGI8
IDT70T633S12BFI8 Dual-Port SRAM, 512KX18, 12ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FBGA-208 Integrated Device Technology Inc 70T633S12BFGI8 vs IDT70T633S12BFI8
70T633S12BFI8 512K x 18, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA0/Reel Renesas Electronics Corporation 70T633S12BFGI8 vs 70T633S12BFI8
70T633S12BFGI 512K x 18, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA126/Tray Renesas Electronics Corporation 70T633S12BFGI8 vs 70T633S12BFGI
70T633S12BFI8 CABGA-208, Reel Integrated Device Technology Inc 70T633S12BFGI8 vs 70T633S12BFI8
Part Number Description Manufacturer Compare
70T3339S133BFGI CABGA-208, Tray Integrated Device Technology Inc 70T633S12BFGI8 vs 70T3339S133BFGI
IDT70T631S8BFG Dual-Port SRAM, 256KX18, 8ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HIEGHT, 0.80 MM, PITCH, GREEN, FPBGA-208 Integrated Device Technology Inc 70T633S12BFGI8 vs IDT70T631S8BFG
IDT70T3339S166BF8 Dual-Port SRAM, 512KX18, 12ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FPBGA-208 Integrated Device Technology Inc 70T633S12BFGI8 vs IDT70T3339S166BF8
AS9C25256M2018L-133FI Dual-Port SRAM, 256KX18, 12ns, CMOS, PBGA208, FBGA-208 Alliance Semiconductor Corporation 70T633S12BFGI8 vs AS9C25256M2018L-133FI
70T633S12BFI8 CABGA-208, Reel Integrated Device Technology Inc 70T633S12BFGI8 vs 70T633S12BFI8
70V7339S133BF8 CABGA-208, Reel Integrated Device Technology Inc 70T633S12BFGI8 vs 70V7339S133BF8
70T631S8BF Dual-Port SRAM, 256KX18, 8ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FBGA-208 Integrated Device Technology Inc 70T633S12BFGI8 vs 70T631S8BF
IDT70T633S12BFG Dual-Port SRAM, 512KX18, 12ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HIEGHT, 0.80 MM, PITCH, GREEN, FPBGA-208 Integrated Device Technology Inc 70T633S12BFGI8 vs IDT70T633S12BFG
70T633S8BFG Dual-Port SRAM, 512KX18, 8ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, GREEN, FPBGA-208 Integrated Device Technology Inc 70T633S12BFGI8 vs 70T633S8BFG
70T3339S166BF CABGA-208, Tray Integrated Device Technology Inc 70T633S12BFGI8 vs 70T3339S166BF

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