| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| IDT7130S55J | Integrated Device Technology Inc | Check for Price | Multi-Port SRAM, 1KX8, 55ns, CMOS, PQCC52 | 7130LA55JG vs IDT7130S55J |
| 7130LA55J | Integrated Device Technology Inc | Check for Price | Multi-Port SRAM, 1KX8, 55ns, CMOS, PQCC52 | 7130LA55JG vs 7130LA55J |
| IDT7130SA55JB | Integrated Device Technology Inc | Check for Price | Multi-Port SRAM, 1KX8, 55ns, CMOS, PQCC52 | 7130LA55JG vs IDT7130SA55JB |
| 7130LA55JB | Integrated Device Technology Inc | Check for Price | Multi-Port SRAM, 1KX8, 55ns, CMOS, PQCC52 | 7130LA55JG vs 7130LA55JB |
| IDT7130LA55JI8 | Integrated Device Technology Inc | Check for Price | Multi-Port SRAM, 1KX8, 55ns, CMOS, PQCC52 | 7130LA55JG vs IDT7130LA55JI8 |
| 7130LA55JG | Renesas Electronics Corporation | Check for Price | Multi-Port SRAM, 1KX8, 55ns, CMOS, PQCC52 | 7130LA55JG vs 7130LA55JG |
| IDT7130SA55JI8 | Integrated Device Technology Inc | Check for Price | Multi-Port SRAM, 1KX8, 55ns, CMOS, PQCC52 | 7130LA55JG vs IDT7130SA55JI8 |
| 7130SA55JGI8 | Integrated Device Technology Inc | Check for Price | Multi-Port SRAM, 1KX8, 55ns, CMOS, PQCC52 | 7130LA55JG vs 7130SA55JGI8 |
| 7130LA55JGI8 | Integrated Device Technology Inc | Check for Price | Multi-Port SRAM, 1KX8, 55ns, CMOS, PQCC52 | 7130LA55JG vs 7130LA55JGI8 |
| IDT7130LA55JGB | Renesas Electronics Corporation | Check for Price | Multi-Port SRAM, 1KX8, 55ns, CMOS, PQCC52 | 7130LA55JG vs IDT7130LA55JGB |
Part Details for 7130LA55JG by Integrated Device Technology Inc
Results Overview of 7130LA55JG by Integrated Device Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- Tariff Estimator: (Available) NEW
- Number of Functional Equivalents: (10 options)
- CAD Models: (Request Part)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Education and Research
Internet of Things (IoT)
Computing and Data Storage
Aerospace and Defense
Healthcare
Energy and Power Systems
Renewable Energy
Telecommunications
Automotive
7130LA55JG Information
7130LA55JG by Integrated Device Technology Inc is an SRAM.
SRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
US Tariff Estimator: 7130LA55JG by Integrated Device Technology Inc
Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.
7130LA55JG Part Data Attributes
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7130LA55JG
Integrated Device Technology Inc
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Datasheet
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7130LA55JG
Integrated Device Technology Inc
Multi-Port SRAM, 1KX8, 55ns, CMOS, PQCC52
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Part Package Code | LCC | |
| Package Description | 0.750 X 0.750 Inch, 0.170 Inch Height, Green, Plastic, Lcc-52 | |
| Pin Count | 52 | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 55 Ns | |
| I/O Type | Common | |
| JESD-30 Code | S-PQCC-J52 | |
| JESD-609 Code | e3 | |
| Length | 19.1262 Mm | |
| Memory Density | 8192 Bit | |
| Memory IC Type | Multi-Port Sram | |
| Memory Width | 8 | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Ports | 2 | |
| Number of Terminals | 52 | |
| Number of Words | 1024 Words | |
| Number of Words Code | 1000 | |
| Operating Mode | Asynchronous | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 1kx8 | |
| Output Characteristics | 3-State | |
| Package Body Material | Plastic/Epoxy | |
| Package Code | QCCJ | |
| Package Equivalence Code | LDCC52,.8SQ | |
| Package Shape | Square | |
| Package Style | Chip Carrier | |
| Parallel/Serial | Parallel | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 4.572 Mm | |
| Standby Current-Max | 0.0015 A | |
| Standby Voltage-Min | 2 V | |
| Supply Current-Max | 0.11 Ma | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | Yes | |
| Technology | Cmos | |
| Temperature Grade | Commercial | |
| Terminal Finish | Matte Tin (Sn) - Annealed | |
| Terminal Form | J Bend | |
| Terminal Pitch | 1.27 Mm | |
| Terminal Position | Quad | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 19.1262 Mm |
Alternate Parts for 7130LA55JG
This table gives cross-reference parts and alternative options found for 7130LA55JG. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 7130LA55JG, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
7130LA55JG Frequently Asked Questions (FAQ)
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A good PCB layout for the 7130LA55JG involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
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To ensure proper powering and decoupling, use a high-quality power supply with low noise and ripple. Add decoupling capacitors (e.g., 0.1uF and 10uF) close to the device, and consider adding a ferrite bead or a power inductor to filter out high-frequency noise.
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The 7130LA55JG is rated for operation from -40°C to +85°C. However, it's essential to consider the device's thermal characteristics and ensure proper heat dissipation to maintain reliability and performance.
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While the 7130LA55JG is a robust device, it's still susceptible to vibration-induced failures. To ensure reliability in high-vibration environments, consider using vibration-dampening materials, securing the device with a robust mounting system, and following proper PCB design and assembly practices.
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To troubleshoot issues with the 7130LA55JG, start by verifying the power supply and decoupling. Check for proper signal integrity, ensure correct pin connections, and review the PCB layout for potential issues. Use oscilloscopes and logic analyzers to debug the device's behavior and identify potential faults.