Part Details for 71T75602S200BGGI by Integrated Device Technology Inc
Overview of 71T75602S200BGGI by Integrated Device Technology Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for 71T75602S200BGGI
| Part # | Distributor | Description | Stock | Price | Buy | |
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Rochester Electronics | 71T75602 - 512K X 36, 2.5V Synchronous ZBT SRAM 2.5V I/O, Burst Counter Pipelined Output ' RoHS: Compliant Status: Obsolete Min Qty: 1 | 8 |
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$8.0500 / $9.4800 | Buy Now |
Part Details for 71T75602S200BGGI
71T75602S200BGGI CAD Models
71T75602S200BGGI Part Data Attributes
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71T75602S200BGGI
Integrated Device Technology Inc
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Datasheet
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Compare Parts:
71T75602S200BGGI
Integrated Device Technology Inc
ZBT SRAM, 512KX36, 3.2ns, CMOS, PBGA119, 14 X 22 MM, GREEN, MS-028AA, BGA-119
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Part Package Code | BGA | |
| Package Description | 14 X 22 MM, GREEN, MS-028AA, BGA-119 | |
| Pin Count | 119 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 3.2 ns | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| Clock Frequency-Max (fCLK) | 200 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PBGA-B119 | |
| JESD-609 Code | e1 | |
| Length | 22 mm | |
| Memory Density | 18874368 bit | |
| Memory IC Type | ZBT SRAM | |
| Memory Width | 36 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 119 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 512KX36 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA119,7X17,50 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.36 mm | |
| Standby Voltage-Min | 2.38 V | |
| Supply Voltage-Max (Vsup) | 2.625 V | |
| Supply Voltage-Min (Vsup) | 2.375 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 14 mm |
Alternate Parts for 71T75602S200BGGI
This table gives cross-reference parts and alternative options found for 71T75602S200BGGI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 71T75602S200BGGI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 71T75602S200BGGI8 | ZBT SRAM, 512KX36, 3.2ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, MS-028AA, BGA-119 | Integrated Device Technology Inc | 71T75602S200BGGI vs 71T75602S200BGGI8 |
| 71T75602S166BGI | 2.5V 512K X 36 ZBT Synchronous 2.5V I/O PipeLine SRAM, PBGA84/Tray | Renesas Electronics Corporation | 71T75602S200BGGI vs 71T75602S166BGI |
| CY7C1370BV25-200BGC | ZBT SRAM, 512KX36, 3ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119 | Cypress Semiconductor | 71T75602S200BGGI vs CY7C1370BV25-200BGC |
| KM736S949H-60 | ZBT SRAM, 512KX36, 3.5ns, CMOS, PBGA119, BGA-119 | Samsung Semiconductor | 71T75602S200BGGI vs KM736S949H-60 |
| IDT71T75602S166BGI8 | ZBT SRAM, 512KX36, 3.5ns, CMOS, PBGA119, 14 X 22 MM, MS-028-AA, BGA-119 | Integrated Device Technology Inc | 71T75602S200BGGI vs IDT71T75602S166BGI8 |
| 71T75602S166BGGI | PBGA-119, Tray | Integrated Device Technology Inc | 71T75602S200BGGI vs 71T75602S166BGGI |
| 71T75602S200BGG | ZBT SRAM, 512KX36, PBGA119, 14 X 22 MM, GREEN, MS-028AA, BGA-119 | Integrated Device Technology Inc | 71T75602S200BGGI vs 71T75602S200BGG |
| IDT71T75602S200BG | ZBT SRAM, 512KX36, 3.2ns, CMOS, PBGA119, 14 X 22 MM, MS-028-AA, BGA-119 | Integrated Device Technology Inc | 71T75602S200BGGI vs IDT71T75602S200BG |
| 71T75602S200BG8 | ZBT SRAM, 512KX36, 3.2ns, CMOS, PBGA119, 14 X 22 MM, MS-028-AA, BGA-119 | Integrated Device Technology Inc | 71T75602S200BGGI vs 71T75602S200BG8 |
| IDT71T75602S166BGG | ZBT SRAM, 512KX36, 3.5ns, CMOS, PBGA119, 14 X 22 MM, MS-028-AA, BGA-119 | Integrated Device Technology Inc | 71T75602S200BGGI vs IDT71T75602S166BGG |