Datasheets
82S123BEA by:

OTP ROM, 32X8, 50ns, Bipolar, CDIP16,

Part Details for 82S123BEA by e2v technologies

Overview of 82S123BEA by e2v technologies

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Part Details for 82S123BEA

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82S123BEA Part Data Attributes

82S123BEA e2v technologies
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82S123BEA e2v technologies OTP ROM, 32X8, 50ns, Bipolar, CDIP16,
Part Life Cycle Code Obsolete
Ihs Manufacturer TELEDYNE E2V (UK) LTD
Package Description ,
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 50 ns
JESD-30 Code R-CDIP-T16
Memory Density 256 bit
Memory IC Type OTP ROM
Memory Width 8
Number of Functions 1
Number of Terminals 16
Number of Words 32 words
Number of Words Code 32
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 32X8
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology BIPOLAR
Temperature Grade MILITARY
Terminal Form THROUGH-HOLE
Terminal Position DUAL

Alternate Parts for 82S123BEA

This table gives cross-reference parts and alternative options found for 82S123BEA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 82S123BEA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
82S23/BEA IC 32 X 8 OTPROM, 50 ns, CDIP16, 0.300 INCH, CERAMIC, DIP-16, Programmable ROM NXP Semiconductors 82S123BEA vs 82S23/BEA
N82S23N OTP ROM, 32X8, 50ns, Bipolar, PDIP16, YAGEO Corporation 82S123BEA vs N82S23N
82S123/BEA OTP ROM, 32X8, 50ns, Bipolar, CDIP16, YAGEO Corporation 82S123BEA vs 82S123/BEA
5962-8670301EA OTP ROM, 32X8, 50ns, Bipolar, CDIP16, CERAMIC, DIP-16 e2v technologies 82S123BEA vs 5962-8670301EA
N82S123B OTP ROM, 32X8, 50ns, Bipolar, PDIP16, Signetics 82S123BEA vs N82S123B
N82S23N OTP ROM, 32X8, 50ns, Bipolar, PDIP16, Signetics 82S123BEA vs N82S23N
N82S123F OTP ROM, 32X8, 50ns, Bipolar, CDIP16, Signetics 82S123BEA vs N82S123F
5962-8670301EX OTP ROM, 32X8, 50ns, Bipolar, CDIP16, CERAMIC, DIP-16 e2v technologies 82S123BEA vs 5962-8670301EX
N82S123B IC 32 X 8 OTPROM, 50 ns, PDIP16, Programmable ROM NXP Semiconductors 82S123BEA vs N82S123B
N82S23B OTP ROM, 32X8, 50ns, Bipolar, PDIP16, Signetics 82S123BEA vs N82S23B
Part Number Description Manufacturer Compare
IDM29750JC 32X8 OTPROM, 30ns, CDIP16, HERMETIC SEALED, DIP-16 Texas Instruments 82S123BEA vs IDM29750JC
M54730AS-2 OTP ROM, 32X8, 35ns, Bipolar, CDIP16, METAL SEALED, CERAMIC, DIP-16 Mitsubishi Electric 82S123BEA vs M54730AS-2
AM27S19SAPCB OTP ROM, 32X8, 15ns, Bipolar, PDIP16, PLASTIC, DIP-16 AMD 82S123BEA vs AM27S19SAPCB
N82S123B IC 32 X 8 OTPROM, 50 ns, PDIP16, Programmable ROM NXP Semiconductors 82S123BEA vs N82S123B
DM74S288AJ 32X8 OTPROM, 25ns, CDIP16, CERAMIC, DIP-16 Texas Instruments 82S123BEA vs DM74S288AJ
S82S123F883B 32X8 OTPROM, 65ns, CDIP16, DIP-16 Philips Semiconductors 82S123BEA vs S82S123F883B
DM54S288J/883C 32X8 OTPROM, 45ns, CDIP16, CERAMIC, DIP-16 Texas Instruments 82S123BEA vs DM54S288J/883C
M38510/20703BEX OTP ROM, 32X8, 35ns, Bipolar, 0.25 X 0.875 INCH, DIP-16 Lansdale Semiconductor Inc 82S123BEA vs M38510/20703BEX
82S23/BEA IC 32 X 8 OTPROM, 50 ns, CDIP16, 0.300 INCH, CERAMIC, DIP-16, Programmable ROM NXP Semiconductors 82S123BEA vs 82S23/BEA
N82S123N OTP ROM, 32X8, 50ns, Bipolar, PDIP16, YAGEO Corporation 82S123BEA vs N82S123N

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