Part Details for IDM29750JC by Texas Instruments
Overview of IDM29750JC by Texas Instruments
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (9 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Aerospace and Defense
Agriculture Technology
Robotics and Drones
Part Details for IDM29750JC
IDM29750JC CAD Models
IDM29750JC Part Data Attributes:
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IDM29750JC
Texas Instruments
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Datasheet
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IDM29750JC
Texas Instruments
32X8 OTPROM, 30ns, CDIP16, HERMETIC SEALED, DIP-16
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NATIONAL SEMICONDUCTOR CORP | |
| Part Package Code | DIP | |
| Package Description | DIP, DIP16,.3 | |
| Pin Count | 16 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 30 ns | |
| JESD-30 Code | R-GDIP-T16 | |
| JESD-609 Code | e0 | |
| Length | 19.43 mm | |
| Memory Density | 256 bit | |
| Memory IC Type | OTP ROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 16 | |
| Number of Words | 32 words | |
| Number of Words Code | 32 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 32X8 | |
| Output Characteristics | OPEN-COLLECTOR | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP16,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.08 mm | |
| Supply Current-Max | 0.11 mA | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | BIPOLAR | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 7.62 mm |
Alternate Parts for IDM29750JC
This table gives cross-reference parts and alternative options found for IDM29750JC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IDM29750JC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| IDM29750JC | IC 32 X 8 OTPROM, 30 ns, CDIP16, HERMETIC SEALED, DIP-16, Programmable ROM | National Semiconductor Corporation | IDM29750JC vs IDM29750JC |
| IDM29751JC | 32X8 OTPROM, 30ns, CDIP16, HERMETIC SEALED, DIP-16 | Texas Instruments | IDM29750JC vs IDM29751JC |
| M54731AS-1 | OTP ROM, 32X8, 30ns, Bipolar, CDIP16, METAL SEALED, CERAMIC, DIP-16 | Mitsubishi Electric | IDM29750JC vs M54731AS-1 |
| M54731AP-1 | OTP ROM, 32X8, 30ns, Bipolar, PDIP16, PLASTIC, DIP-16 | Mitsubishi Electric | IDM29750JC vs M54731AP-1 |
| IDM29750NC | IC 32 X 8 OTPROM, 30 ns, PDIP16, PLASTIC, DIP-16, Programmable ROM | National Semiconductor Corporation | IDM29750JC vs IDM29750NC |
| 82S23B/BEA | IC 32 X 8 OTPROM, 30 ns, CDIP16, 0.300 INCH, CERAMIC, DIP-16, Programmable ROM | NXP Semiconductors | IDM29750JC vs 82S23B/BEA |
| 82S123B/BEA | IC 32 X 8 OTPROM, 30 ns, CDIP16, 0.300 INCH, CERAMIC, DIP-16, Programmable ROM | NXP Semiconductors | IDM29750JC vs 82S123B/BEA |
| IDM29751JC | IC 32 X 8 OTPROM, 30 ns, CDIP16, HERMETIC SEALED, DIP-16, Programmable ROM | National Semiconductor Corporation | IDM29750JC vs IDM29751JC |
| 82S123B/BEA | OTP ROM, 32X8, 30ns, Bipolar, CDIP16, | YAGEO Corporation | IDM29750JC vs 82S123B/BEA |