| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| ADS5510IPAPR | Texas Instruments | Check for Price | ADC, Proprietary Method, 11-Bit, 1 Func, 1 Channel, Parallel, Word Access, CMOS, PQFP64 | ADS5510IPAP vs ADS5510IPAPR |
Part Details for ADS5510IPAP by Texas Instruments
Results Overview of ADS5510IPAP by Texas Instruments
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (1 replacement)
- Tariff Estimator: (Available) NEW
- Number of Functional Equivalents: (0 options)
- CAD Models: (Available)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Education and Research
Internet of Things (IoT)
Computing and Data Storage
Aerospace and Defense
Healthcare
Telecommunications
Automotive
ADS5510IPAP Information
ADS5510IPAP by Texas Instruments is an Analog to Digital Converter.
Analog to Digital Converters are under the broader part category of Converters.
A converter is an electrical circuit that transforms electric energy into a different form that will support a elecrical load needed by a device. Read more about Converters on our Converters part category page.
Price & Stock for ADS5510IPAP
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
296-21509-ND
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DigiKey | IC ADC 11BIT 64-HTQFP Min Qty: 160 Container: Tray |
0 Tray |
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$48.2143 | Buy Now |
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DISTI #
86274968
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Verical | 1-Channel Single ADC Pipelined 125Msps 11-bit Parallel 64-Pin HTQFP EP Tray RoHS: Compliant Min Qty: 25 Package Multiple: 1 | Americas - 4480 |
|
$41.2000 / $51.5000 | Buy Now |
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DISTI #
86275763
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Verical | 1-Channel Single ADC Pipelined 125Msps 11-bit Parallel 64-Pin HTQFP EP Tray RoHS: Compliant Min Qty: 25 Package Multiple: 1 Date Code: 1101 | Americas - 59 |
|
$41.2000 / $51.5000 | Buy Now |
|
DISTI #
595-ADS5510IPAP
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Mouser Electronics | Analog to Digital Converters - ADC 11-Bit 125 MSPS RoHS: Compliant | 0 |
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$48.2200 | Order Now |
|
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Rochester Electronics | IC ADC 1 CONV 11Bits Pipelined Parallel 64-QFP Tray RoHS: Compliant Status: Active Min Qty: 1 | 4606 |
|
$32.9600 / $41.2000 | Buy Now |
US Tariff Estimator: ADS5510IPAP by Texas Instruments
Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.
ADS5510IPAP CAD Models
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ADS5510IPAP Part Data Attributes
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ADS5510IPAP
Texas Instruments
Buy Now
Datasheet
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Compare Parts:
ADS5510IPAP
Texas Instruments
ADC, Proprietary Method, 11-Bit, 1 Func, 1 Channel, Parallel, Word Access, CMOS, PQFP64
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Part Package Code | QFP | |
| Package Description | Htfqfp-64 | |
| Pin Count | 64 | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.30 | |
| Additional Feature | Peak-To-Peak Input Voltage Range(V) : 2.3 | |
| Analog Input Voltage-Max | 2.3 V | |
| Analog Input Voltage-Min | -2.3 V | |
| Converter Type | Adc, Proprietary Method | |
| JESD-30 Code | S-PQFP-G64 | |
| JESD-609 Code | e4 | |
| Length | 10 Mm | |
| Linearity Error-Max (EL) | 0.0732% | |
| Moisture Sensitivity Level | 3 | |
| Number of Analog In Channels | 1 | |
| Number of Bits | 11 | |
| Number of Functions | 1 | |
| Number of Terminals | 64 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Output Bit Code | OFFSET 2S COMPLEMENT | |
| Output Format | Parallel, Word | |
| Package Body Material | Plastic/Epoxy | |
| Package Code | HTFQFP | |
| Package Equivalence Code | TQFP64,.47SQ | |
| Package Shape | Square | |
| Package Style | Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Sample Rate | 125 Mhz | |
| Sample and Hold / Track and Hold | Sample | |
| Seated Height-Max | 1.2 Mm | |
| Supply Current-Max | 260 Ma | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | Yes | |
| Technology | Cmos | |
| Temperature Grade | Industrial | |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | |
| Terminal Form | Gull Wing | |
| Terminal Pitch | 0.5 Mm | |
| Terminal Position | Quad | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 10 Mm |
Alternate Parts for ADS5510IPAP
This table gives cross-reference parts and alternative options found for ADS5510IPAP. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of ADS5510IPAP, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
ADS5510IPAP Frequently Asked Questions (FAQ)
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Texas Instruments provides a recommended layout and routing guide in the ADS5510IPAP evaluation module documentation. It's essential to follow the guidelines for decoupling, grounding, and signal routing to minimize noise and ensure optimal performance.
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The ADS5510IPAP uses a standard SPI interface. Ensure that the clock polarity (CPOL) and clock phase (CPHA) are set correctly, and the chip select (CS) is asserted low during data transfer. Refer to the datasheet and application notes for specific configuration details.
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The ADS5510IPAP can achieve a maximum sampling rate of 125 MSPS. However, the power consumption increases with the sampling rate. To minimize power consumption, consider reducing the sampling rate or using the device's power-down modes.
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The ADS5510IPAP outputs 14-bit data in a two's complement format. Ensure that your system is configured to handle this data format and word length. You may need to perform data formatting and scaling depending on your application requirements.
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The ADS5510IPAP has a maximum junction temperature (TJ) of 125°C. Ensure good thermal conductivity by using a heat sink, thermal vias, and a thermally efficient PCB design. Monitor the device temperature and adjust the operating conditions to prevent overheating.