Datasheets
AM27LS19PC by: AMD

OTP ROM, 32X8, 55ns, Bipolar, PDIP16, PLASTIC, DIP-16

Part Details for AM27LS19PC by AMD

Overview of AM27LS19PC by AMD

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Price & Stock for AM27LS19PC

Part # Distributor Description Stock Price Buy
Bristol Electronics   9
RFQ
Quest Components PROM, 32 x 8, 16 Pin, Plastic, DIP 5
  • 1 $19.5000
$19.5000 Buy Now
Quest Components PROM, 32 x 8, 16 Pin, Plastic, DIP 3344
  • 1 $30.0000
  • 209 $23.2500
  • 431 $22.5000
$22.5000 / $30.0000 Buy Now

Part Details for AM27LS19PC

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AM27LS19PC Part Data Attributes

AM27LS19PC AMD
Buy Now Datasheet
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AM27LS19PC AMD OTP ROM, 32X8, 55ns, Bipolar, PDIP16, PLASTIC, DIP-16
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Part Package Code DIP
Package Description DIP, DIP16,.3
Pin Count 16
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 55 ns
JESD-30 Code R-PDIP-T16
JESD-609 Code e0
Length 19.05 mm
Memory Density 256 bit
Memory IC Type OTP ROM
Memory Width 8
Number of Functions 1
Number of Terminals 16
Number of Words 32 words
Number of Words Code 32
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 75 °C
Operating Temperature-Min
Organization 32X8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.08 mm
Supply Current-Max 0.08 mA
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology BIPOLAR
Temperature Grade COMMERCIAL EXTENDED
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 7.62 mm

Alternate Parts for AM27LS19PC

This table gives cross-reference parts and alternative options found for AM27LS19PC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27LS19PC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
AM27LS19DC OTP ROM, 32X8, 55ns, Bipolar, CDIP16, CERAMIC, DIP-16 AMD AM27LS19PC vs AM27LS19DC
AM27LS19DCB OTP ROM, 32X8, 55ns, Bipolar, CDIP16, CERAMIC, DIP-16 AMD AM27LS19PC vs AM27LS19DCB
AM27LS18DCB OTP ROM, 32X8, 55ns, Bipolar, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 AMD AM27LS19PC vs AM27LS18DCB
AM27LS18DC OTP ROM, 32X8, 55ns, Bipolar, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 AMD AM27LS19PC vs AM27LS18DC
AM27LS19PCB OTP ROM, 32X8, 55ns, Bipolar, PDIP16, PLASTIC, DIP-16 AMD AM27LS19PC vs AM27LS19PCB
Part Number Description Manufacturer Compare
IDM29750JC 32X8 OTPROM, 30ns, CDIP16, HERMETIC SEALED, DIP-16 Texas Instruments AM27LS19PC vs IDM29750JC
M54730AS-2 OTP ROM, 32X8, 35ns, Bipolar, CDIP16, METAL SEALED, CERAMIC, DIP-16 Mitsubishi Electric AM27LS19PC vs M54730AS-2
AM27S19SAPCB OTP ROM, 32X8, 15ns, Bipolar, PDIP16, PLASTIC, DIP-16 AMD AM27LS19PC vs AM27S19SAPCB
N82S123B IC 32 X 8 OTPROM, 50 ns, PDIP16, Programmable ROM NXP Semiconductors AM27LS19PC vs N82S123B
DM74S288AJ 32X8 OTPROM, 25ns, CDIP16, CERAMIC, DIP-16 Texas Instruments AM27LS19PC vs DM74S288AJ
S82S123F883B 32X8 OTPROM, 65ns, CDIP16, DIP-16 Philips Semiconductors AM27LS19PC vs S82S123F883B
DM54S288J/883C 32X8 OTPROM, 45ns, CDIP16, CERAMIC, DIP-16 Texas Instruments AM27LS19PC vs DM54S288J/883C
M38510/20703BEX OTP ROM, 32X8, 35ns, Bipolar, 0.25 X 0.875 INCH, DIP-16 Lansdale Semiconductor Inc AM27LS19PC vs M38510/20703BEX
82S23/BEA IC 32 X 8 OTPROM, 50 ns, CDIP16, 0.300 INCH, CERAMIC, DIP-16, Programmable ROM NXP Semiconductors AM27LS19PC vs 82S23/BEA
N82S123N OTP ROM, 32X8, 50ns, Bipolar, PDIP16, YAGEO Corporation AM27LS19PC vs N82S123N

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