Part Details for AM27S23DCB by AMD
Overview of AM27S23DCB by AMD
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Part Details for AM27S23DCB
AM27S23DCB CAD Models
AM27S23DCB Part Data Attributes
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AM27S23DCB
AMD
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Datasheet
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AM27S23DCB
AMD
OTP ROM, 256X8, 45ns, Bipolar, CDIP20, CERAMIC, DIP-20
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Part Package Code | DIP | |
| Package Description | DIP, DIP20,.3 | |
| Pin Count | 20 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 45 ns | |
| JESD-30 Code | R-CDIP-T20 | |
| JESD-609 Code | e0 | |
| Length | 24.257 mm | |
| Memory Density | 2048 bit | |
| Memory IC Type | OTP ROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 20 | |
| Number of Words | 256 words | |
| Number of Words Code | 256 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 75 °C | |
| Operating Temperature-Min | ||
| Organization | 256X8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP20,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.08 mm | |
| Supply Current-Max | 0.16 mA | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | BIPOLAR | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 7.62 mm |
Alternate Parts for AM27S23DCB
This table gives cross-reference parts and alternative options found for AM27S23DCB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27S23DCB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 63S280J | OTP ROM, 256X8, 45ns, CMOS, CDIP20, | Monolithic Memories (RETIRED) | AM27S23DCB vs 63S280J |
| 63S280JXXXX | OTP ROM, 256X8, 45ns, CMOS, CDIP20, | Monolithic Memories (RETIRED) | AM27S23DCB vs 63S280JXXXX |
| AM27S23DC | OTP ROM, 256X8, 45ns, Bipolar, CDIP20, CERAMIC, DIP-20 | AMD | AM27S23DCB vs AM27S23DC |
| N82S135NB | OTP ROM, 256X8, 45ns, Bipolar, PDIP20 | Signetics | AM27S23DCB vs N82S135NB |
| 63S280N | OTP ROM, 256X8, 45ns, CMOS, PDIP20, | Monolithic Memories (RETIRED) | AM27S23DCB vs 63S280N |
| 63S281JXXXX | OTP ROM, 256X8, 45ns, CMOS, CDIP20, | Monolithic Memories (RETIRED) | AM27S23DCB vs 63S281JXXXX |
| AM27S23PCB | OTP ROM, 256X8, 45ns, Bipolar, PDIP20, PLASTIC, DIP-20 | AMD | AM27S23DCB vs AM27S23PCB |
| N82S135N | OTP ROM, 256X8, 45ns, Bipolar, PDIP20 | Signetics | AM27S23DCB vs N82S135N |
| 63S281NXXXX | OTP ROM, 256X8, 45ns, CMOS, PDIP20, | Monolithic Memories (RETIRED) | AM27S23DCB vs 63S281NXXXX |
| MB7117EM | OTP ROM, 256X8, 45ns, Bipolar, PDIP20, PLASTIC, DIP-20 | FUJITSU Semiconductor Limited | AM27S23DCB vs MB7117EM |