Part Details for AS4C32M16D2-25BCN by Alliance Memory Inc
Results Overview of AS4C32M16D2-25BCN by Alliance Memory Inc
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (3 replacements)
- Tariff Estimator: (Available) NEW
- Number of Functional Equivalents: (10 options)
- CAD Models: (Request Part)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
AS4C32M16D2-25BCN Information
AS4C32M16D2-25BCN by Alliance Memory Inc is a DRAM.
DRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for AS4C32M16D2-25BCN
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
DISTI #
913-AS4C32M16D225BCN
|
Mouser Electronics | DRAM 512M, 1.8V, 32M x 16 DDR2 RoHS: Compliant | 0 |
|
Order Now | |
|
|
Karl Kruse GmbH & Co KG | DDR2 512Mb 32M x 16 1.8V 84-ball BGA 400 MHz Commercial Temp | 3365 |
|
RFQ |
US Tariff Estimator: AS4C32M16D2-25BCN by Alliance Memory Inc
Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.
Part Details for AS4C32M16D2-25BCN
AS4C32M16D2-25BCN Part Data Attributes
|
|
AS4C32M16D2-25BCN
Alliance Memory Inc
Buy Now
Datasheet
|
Compare Parts:
AS4C32M16D2-25BCN
Alliance Memory Inc
DDR DRAM, 32MX16, CMOS, PBGA84, 8 X 12.50 MM, 1.20 MM HEIGHT, HALOGEN FREE AND ROHS COMPLIANT, TFBGA-84
|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Package Description | 8 X 12.50 Mm, 1.20 Mm Height, Halogen Free And Rohs Compliant, Tfbga-84 | |
| Reach Compliance Code | Compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.28 | |
| Access Mode | Four Bank Page Burst | |
| Additional Feature | Auto/Self Refresh | |
| JESD-30 Code | R-PBGA-B84 | |
| Length | 12.5 Mm | |
| Memory Density | 536870912 Bit | |
| Memory IC Type | Ddr Dram | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 84 | |
| Number of Words | 33554432 Words | |
| Number of Words Code | 32000000 | |
| Operating Mode | Synchronous | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 32mx16 | |
| Package Body Material | Plastic/Epoxy | |
| Package Code | TFBGA | |
| Package Shape | Rectangular | |
| Package Style | Grid Array, Thin Profile, Fine Pitch | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 1.2 Mm | |
| Self Refresh | Yes | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | Yes | |
| Technology | Cmos | |
| Temperature Grade | Other | |
| Terminal Form | Ball | |
| Terminal Pitch | 0.8 Mm | |
| Terminal Position | Bottom | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 8 Mm |
Alternate Parts for AS4C32M16D2-25BCN
This table gives cross-reference parts and alternative options found for AS4C32M16D2-25BCN. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AS4C32M16D2-25BCN, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| AS4C32M16D2-25BINTR | Alliance Memory Inc | Check for Price | DDR DRAM, 32MX16, 0.4ns, CMOS, PBGA84 | AS4C32M16D2-25BCN vs AS4C32M16D2-25BINTR |
| AS4C32M16D2-25BCNTR | Alliance Memory Inc | Check for Price | DDR DRAM, 32MX16, 0.4ns, CMOS, PBGA84 | AS4C32M16D2-25BCN vs AS4C32M16D2-25BCNTR |
| AS4C32M16D2-25BIN | Alliance Memory Inc | Check for Price | DDR DRAM, 32MX16, 0.4ns, CMOS, PBGA84, 8 X 12.50 MM, 1.20 MM HEIGHT, HALOGEN FREE AND ROHS COMPLIANT, TFBGA-84 | AS4C32M16D2-25BCN vs AS4C32M16D2-25BIN |
AS4C32M16D2-25BCN Frequently Asked Questions (FAQ)
-
The AS4C32M16D2-25BCN has an industrial temperature range of -40°C to 85°C, making it suitable for use in a wide range of applications.
-
The AS4C32M16D2-25BCN requires a refresh cycle every 64ms, with a minimum of 4096 refresh cycles within an 64ms interval. You can use a refresh counter to keep track of the refresh cycles and issue an auto-refresh command (CBR) to the SDRAM.
-
The AS4C32M16D2-25BCN supports a maximum clock frequency of 166MHz, making it suitable for high-speed applications.
-
During power-up, the SDRAM should be held in a reset state (CKE low, CS low, and RAS, CAS, and WE high) until the power supply reaches a stable level. During power-down, the SDRAM should be placed in a self-refresh mode to minimize power consumption.
-
The AS4C32M16D2-25BCN has a latency of 2 clock cycles (CL2) for read and write operations.