Part Details for DE52B13H-250 by LSI Corporation
Overview of DE52B13H-250 by LSI Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for DE52B13H-250
DE52B13H-250 CAD Models
DE52B13H-250 Part Data Attributes
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DE52B13H-250
LSI Corporation
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Datasheet
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DE52B13H-250
LSI Corporation
EEPROM, 2KX8, 250ns, Parallel, MOS, CDIP24
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SEEQ TECHNOLOGY INC | |
| Package Description | DIP, DIP24,.6 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 250 ns | |
| Additional Feature | 10000 ERASE/PROGRAM CYCLES; DATA RETENTION > 10 YEARS | |
| Command User Interface | NO | |
| Data Polling | NO | |
| Data Retention Time-Min | 10 | |
| JESD-30 Code | R-GDIP-T24 | |
| JESD-609 Code | e0 | |
| Memory Density | 16384 bit | |
| Memory IC Type | EEPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 2048 words | |
| Number of Words Code | 2000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 2KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP24,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 5 V | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | MOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Toggle Bit | NO |
Alternate Parts for DE52B13H-250
This table gives cross-reference parts and alternative options found for DE52B13H-250. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DE52B13H-250, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| XLS28C16AP3-250 | EEPROM, 2KX8, 250ns, Parallel, CMOS, PDIP24, | Exel Microelectronics Inc | DE52B13H-250 vs XLS28C16AP3-250 |
| PQ52B13-250 | EEPROM, 2KX8, 250ns, Parallel, MOS, PDIP24 | LSI Corporation | DE52B13H-250 vs PQ52B13-250 |
| XLS28C16BP-250 | EEPROM, 2KX8, 250ns, Parallel, CMOS, PDIP24, | Exel Microelectronics Inc | DE52B13H-250 vs XLS28C16BP-250 |
| DM5516A-250 | EEPROM, 2KX8, 250ns, Parallel, NMOS, CDIP24 | LSI Corporation | DE52B13H-250 vs DM5516A-250 |
| XLS28C16AC-250 | EEPROM, 2KX8, 250ns, Parallel, CMOS, CDIP24, | Exel Microelectronics Inc | DE52B13H-250 vs XLS28C16AC-250 |
| KM28C16I-25 | EEPROM, 2KX8, 250ns, Parallel, CMOS, PDIP24, PLASTIC, DIP-24 | Samsung Semiconductor | DE52B13H-250 vs KM28C16I-25 |
| PQ5516A-250 | EEPROM, 2KX8, 250ns, Parallel, MOS, PDIP24 | LSI Corporation | DE52B13H-250 vs PQ5516A-250 |
| PQ52B13H-250 | EEPROM, 2KX8, 250ns, Parallel, MOS, PDIP24 | LSI Corporation | DE52B13H-250 vs PQ52B13H-250 |
| XLE28C16BP-250 | EEPROM, 2KX8, 250ns, Parallel, CMOS, PDIP24, | Exel Microelectronics Inc | DE52B13H-250 vs XLE28C16BP-250 |
| X2816BDI-25 | EEPROM, 2KX8, 250ns, Parallel, NMOS, CDIP24, HERMETIC SEALED, CERDIP-24 | Xicor Inc | DE52B13H-250 vs X2816BDI-25 |