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Memory / SRAMs / GS8662D09BGD-300
Datasheets
GS8662D09BGD-300 by: GSI Technology

QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165

Part Details for GS8662D09BGD-300 by GSI Technology

Overview of GS8662D09BGD-300 by GSI Technology

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Applications Education and Research Internet of Things (IoT) Computing and Data Storage Aerospace and Defense Healthcare Electronic Manufacturing Telecommunications Automotive

Price & Stock for GS8662D09BGD-300

Part # Distributor Description Stock Price Buy
DISTI # GS8662D09BGD-300
Avnet Americas SRAM Chip Sync Dual 1.8V 72M-Bit 8M x 9-Bit 0.45ns 165-Pin FBGA Bulk - Trays (Alt: GS8662D09BGD-300) RoHS: Compliant Min Qty: 144 Package Multiple: 144 Lead time: 24 Weeks, 0 Days Container: Tray 0
  • 144 $82.4670
  • 288 $80.9676
  • 576 $76.9692
  • 864 $74.9700
  • 1,152 $72.4710
  • 1,440 $68.9724
  • 14,400 $66.9732
$66.9732 / $82.4670 Buy Now
DISTI # 464-GS8662D09BGD-300
Mouser Electronics SRAM 1.8 or 1.5V 8M x 9 72M RoHS: Compliant 0
  • 15 $78.3400
  • 30 $76.6200
  • 60 $75.0100
  • 105 $69.5400
$69.5400 / $78.3400 Order Now
Bristol Electronics   11
RFQ
Quest Components   8
  • 1 $93.7580
  • 4 $89.0701
  • 7 $84.3822
$84.3822 / $93.7580 Buy Now

Part Details for GS8662D09BGD-300

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GS8662D09BGD-300 Part Data Attributes

Parametric Data
GS8662D09BGD-300 GSI Technology
Buy Now Datasheet
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GS8662D09BGD-300 GSI Technology QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer GSI TECHNOLOGY
Part Package Code BGA
Package Description 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165
Pin Count 165
Reach Compliance Code compliant
ECCN Code 3A991.B.2.B
HTS Code 8542.32.00.41
Factory Lead Time 24 Weeks
Access Time-Max 0.45 ns
Additional Feature PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 300 MHz
I/O Type SEPARATE
JESD-30 Code R-PBGA-B165
JESD-609 Code e1
Length 15 mm
Memory Density 75497472 bit
Memory IC Type QDR SRAM
Memory Width 9
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 165
Number of Words 8388608 words
Number of Words Code 8000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 8MX9
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 1.4 mm
Standby Current-Max 0.23 A
Standby Voltage-Min 1.7 V
Supply Current-Max 0.58 mA
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 13 mm

Alternate Parts for GS8662D09BGD-300

This table gives cross-reference parts and alternative options found for GS8662D09BGD-300. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8662D09BGD-300, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
GS8662D09BD-300 QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8662D09BGD-300 vs GS8662D09BD-300
Part Number Description Manufacturer Compare
GS8662Q09BGD-167T Standard SRAM, 8MX9, 0.5ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662D09BGD-300 vs GS8662Q09BGD-167T
CY7C1577KV18-500BZI DDR SRAM, 8MX9, 0.33ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Cypress Semiconductor GS8662D09BGD-300 vs CY7C1577KV18-500BZI
CY7C1527AV18-167BZXC DDR SRAM, 8MX9, 0.5ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 Cypress Semiconductor GS8662D09BGD-300 vs CY7C1527AV18-167BZXC
CY7C1527V18-250BZI DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Cypress Semiconductor GS8662D09BGD-300 vs CY7C1527V18-250BZI
CY7C1528V18-200BZXC DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 Cypress Semiconductor GS8662D09BGD-300 vs CY7C1528V18-200BZXC
GS8662R09BGD-167IT Standard SRAM, 8MX9, 0.5ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662D09BGD-300 vs GS8662R09BGD-167IT
GS8662R09BGD-250 Standard SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662D09BGD-300 vs GS8662R09BGD-250
GS8662Q09BGD-300IT QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662D09BGD-300 vs GS8662Q09BGD-300IT
GS8662R09GE-250IT DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 MM X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662D09BGD-300 vs GS8662R09GE-250IT
GS8662Q09BD-300I QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8662D09BGD-300 vs GS8662Q09BD-300I

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