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Memory SRAMs GS8662D18E-300

Memory
GS8662D18E-300
GSI Technology
Description: DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165

Overview of GS8662D18E-300 by GSI Technology

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Where used in Applications: Energy and Power Systems Transportation and Logistics Renewable Energy Automotive

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Part Data Attributes for GS8662D18E-300 by GSI Technology
Parametric Data

GS8662D18E-300
GSI Technology
Buy Now
-
-
Pbfree Code
No
Rohs Code
No
Part Life Cycle Code
Obsolete
Ihs Manufacturer
GSI TECHNOLOGY
Part Package Code
BGA
Package Description
15 X 17 MM, 1 MM PITCH, FPBGA-165
Pin Count
165
Reach Compliance Code
compliant
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Access Time-Max
0.45 ns
Additional Feature
PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK)
300 MHz
I/O Type
SEPARATE
JESD-30 Code
R-PBGA-B165
Length
17 mm
Memory Density
75497472 bit
Memory IC Type
DDR SRAM
Memory Width
18
Moisture Sensitivity Level
3
Number of Functions
1
Number of Terminals
165
Number of Words
4194304 words
Number of Words Code
4000000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
4MX18
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Code
LBGA
Package Equivalence Code
BGA165,11X15,40
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
235
Qualification Status
Not Qualified
Seated Height-Max
1.5 mm
Standby Voltage-Min
1.7 V
Supply Current-Max
0.875 mA
Supply Voltage-Max (Vsup)
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Width
15 mm
Want to compare parts?
  1. GS8662D18E-300
    GSI Technology
    DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165
    VS

Alternate Parts for GS8662D18E-300

This table gives cross-reference parts and alternative options found for GS8662D18E-300. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8662D18E-300, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
IS61QDB44M18A-300B3 QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, TFBGA-165 Integrated Silicon Solution Inc GS8662D18E-300 vs IS61QDB44M18A-300B3
CY7C1513KV18-300BZXC QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Cypress Semiconductor GS8662D18E-300 vs CY7C1513KV18-300BZXC
GS8662D18GE-300T DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662D18E-300 vs GS8662D18GE-300T
IS61QDB44M18A-300M3L QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165 Integrated Silicon Solution Inc GS8662D18E-300 vs IS61QDB44M18A-300M3L
CY7C1513JV18-300BZC QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Cypress Semiconductor GS8662D18E-300 vs CY7C1513JV18-300BZC
GS8662D18BD-300T QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8662D18E-300 vs GS8662D18BD-300T
GS8672D18BGE-300T Standard SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662D18E-300 vs GS8672D18BGE-300T
IS61QDB44M18-300M3 DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, LFBGA-165 Integrated Silicon Solution Inc GS8662D18E-300 vs IS61QDB44M18-300M3
CY7C1513KV18-300BZC QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Cypress Semiconductor GS8662D18E-300 vs CY7C1513KV18-300BZC
GS8662D18E-300T DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8662D18E-300 vs GS8662D18E-300T
Part Number Description Manufacturer Compare
IS61QDB44M18A-300M3L QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165 Integrated Silicon Solution Inc GS8662D18E-300 vs IS61QDB44M18A-300M3L
IS61QDB44M18-300M3 DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, LFBGA-165 Integrated Silicon Solution Inc GS8662D18E-300 vs IS61QDB44M18-300M3
CY7C1513KV18-300BZXC QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Cypress Semiconductor GS8662D18E-300 vs CY7C1513KV18-300BZXC
CY7C1513KV18-300BZC QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Infineon Technologies AG GS8662D18E-300 vs CY7C1513KV18-300BZC
GS8672D18BGE-300T Standard SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662D18E-300 vs GS8672D18BGE-300T
GS8662D18E-300T DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8662D18E-300 vs GS8662D18E-300T
IS61QDB44M18A-300B3 QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, TFBGA-165 Integrated Silicon Solution Inc GS8662D18E-300 vs IS61QDB44M18A-300B3
CY7C1513AV18-300BZC QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Cypress Semiconductor GS8662D18E-300 vs CY7C1513AV18-300BZC
GS8662D18GE-300 DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662D18E-300 vs GS8662D18GE-300
GS8662D18BD-300 QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8662D18E-300 vs GS8662D18BD-300

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