Datasheets
H5TQ4G63MFR-RDI by: SK Hynix Inc

DDR DRAM, 256MX16, 0.195ns, CMOS, PBGA96, HALOGEN FREE AND ROHS COMPLIANT, FBGA-96

Part Details for H5TQ4G63MFR-RDI by SK Hynix Inc

Overview of H5TQ4G63MFR-RDI by SK Hynix Inc

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Applications Consumer Electronics

Part Details for H5TQ4G63MFR-RDI

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H5TQ4G63MFR-RDI Part Data Attributes

H5TQ4G63MFR-RDI SK Hynix Inc
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H5TQ4G63MFR-RDI SK Hynix Inc DDR DRAM, 256MX16, 0.195ns, CMOS, PBGA96, HALOGEN FREE AND ROHS COMPLIANT, FBGA-96
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer SK HYNIX INC
Part Package Code BGA
Package Description TFBGA, BGA96,9X16,32
Pin Count 96
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.36
Access Mode MULTI BANK PAGE BURST
Access Time-Max 0.195 ns
Additional Feature AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 933 MHz
I/O Type COMMON
Interleaved Burst Length 4,8
JESD-30 Code R-PBGA-B96
Length 13 mm
Memory Density 4294967296 bit
Memory IC Type DDR3 DRAM
Memory Width 16
Number of Functions 1
Number of Ports 1
Number of Terminals 96
Number of Words 268435456 words
Number of Words Code 256000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -45 °C
Organization 256MX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA96,9X16,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Refresh Cycles 8192
Seated Height-Max 1.2 mm
Self Refresh YES
Sequential Burst Length 4,8
Standby Current-Max 0.02 A
Supply Current-Max 0.3 mA
Supply Voltage-Max (Vsup) 1.575 V
Supply Voltage-Min (Vsup) 1.425 V
Supply Voltage-Nom (Vsup) 1.5 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 9.4 mm

Alternate Parts for H5TQ4G63MFR-RDI

This table gives cross-reference parts and alternative options found for H5TQ4G63MFR-RDI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of H5TQ4G63MFR-RDI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
H5TQ4G63MFR-H9J DDR DRAM, 256MX16, 0.255ns, CMOS, PBGA96, HALOGEN FREE AND ROHS COMPLIANT, FBGA-96 SK Hynix Inc H5TQ4G63MFR-RDI vs H5TQ4G63MFR-H9J
H5TQ4G63MFR-PBI DDR DRAM, 256MX16, 0.225ns, CMOS, PBGA96, HALOGEN FREE AND ROHS COMPLIANT, FBGA-96 SK Hynix Inc H5TQ4G63MFR-RDI vs H5TQ4G63MFR-PBI
H5TQ4G63MFR-H9C DDR DRAM, 256MX16, 0.255ns, CMOS, PBGA96, HALOGEN FREE AND ROHS COMPLIANT, FBGA-96 SK Hynix Inc H5TQ4G63MFR-RDI vs H5TQ4G63MFR-H9C
H5TQ4G63MFR-PBC DDR DRAM, 256MX16, 0.225ns, CMOS, PBGA96, HALOGEN FREE AND ROHS COMPLIANT, FBGA-96 SK Hynix Inc H5TQ4G63MFR-RDI vs H5TQ4G63MFR-PBC
MT41J256M16RE-15EIT:D DDR DRAM, 256MX16, 0.255ns, CMOS, PBGA96, 10 X 14 MM, LEAD FREE, FBGA-96 Micron Technology Inc H5TQ4G63MFR-RDI vs MT41J256M16RE-15EIT:D
H5TQ4G63MFR-H9I DDR DRAM, 256MX16, 0.255ns, CMOS, PBGA96, HALOGEN FREE AND ROHS COMPLIANT, FBGA-96 SK Hynix Inc H5TQ4G63MFR-RDI vs H5TQ4G63MFR-H9I
H5TQ4G63MFR-RDC DDR DRAM, 256MX16, 0.195ns, CMOS, PBGA96, HALOGEN FREE AND ROHS COMPLIANT, FBGA-96 SK Hynix Inc H5TQ4G63MFR-RDI vs H5TQ4G63MFR-RDC
MT41J256M16RE-125:D DDR DRAM, 256MX16, 0.225ns, CMOS, PBGA96, 10 X 14 MM, LEAD FREE, FBGA-96 Micron Technology Inc H5TQ4G63MFR-RDI vs MT41J256M16RE-125:D
MT41J256M16RE-125IT:D DDR DRAM, 256MX16, CMOS, PBGA96, FBGA-96 Micron Technology Inc H5TQ4G63MFR-RDI vs MT41J256M16RE-125IT:D
MT41J256M16RE-15E:D DDR DRAM, 256MX16, 0.255ns, CMOS, PBGA96, 10 X 14 MM, LEAD FREE, FBGA-96 Micron Technology Inc H5TQ4G63MFR-RDI vs MT41J256M16RE-15E:D

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