HI1837C-D-000
Hughes Aircraft
Description: MASK ROM, 4KX8, 1375ns, CMOS, CDIP24

Overview of HI1837C-D-000 by Hughes Aircraft

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Education and Research Environmental Monitoring Industrial Automation Agriculture Technology Medical Imaging Electronic Manufacturing

Available Datasheets

Part # Manufacturer Description Datasheet
DBL5W5P543A40LF Amphenol Communications Solutions D-Sub Power Board Mount Connectors, Input Output Connectors, Full Power 5W5 Pin Right Angle Solder 40A, Europe Standard, 500 Cycles, Front: Threaded Insert M3, Back: Without Accessory on PCB.
DEL2V2P543H40LF Amphenol Communications Solutions D-Sub Power Board Mount Connectors, Input Output Connectors, Full Power 2V2 Pin Right Angle Solder 40A, Europe Standard, 500 Cycles, Front: Threaded Insert M3, Back: Harpoons for 2.4mm PCB Thickness.
DC8W8P500H30LF Amphenol Communications Solutions D-Sub Power Board Mount Connectors, Input Output Connectors, Full Power 8W8 Pin Right Angle Solder 30A, Europe Standard, 200 Cycles, Front: Without Accessory, Back: Harpoons for 2.4mm PCB Thickness.

CAD Models for HI1837C-D-000 by Hughes Aircraft
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Part Data Attributes for HI1837C-D-000 by Hughes Aircraft

HI1837C-D-000
Hughes Aircraft
-
-
Part Life Cycle Code
Obsolete
Ihs Manufacturer
HUGHES AIRCRAFT
Package Description
,
Reach Compliance Code
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.71
Access Time-Max
150 ns
JESD-30 Code
R-CDIP-T24
Memory Density
65536 bit
Memory IC Type
MASK ROM
Memory Width
8
Number of Functions
1
Number of Terminals
24
Number of Words
4096 words
Number of Words Code
4000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
8KX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Supply Current-Max
0.043 mA
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
THROUGH-HOLE
Terminal Position
DUAL
Want to compare parts?
  1. HI1837C-D-000
    Hughes Aircraft
    MASK ROM, 4KX8, 1375ns, CMOS, CDIP24
    VS

Alternate Parts for HI1837C-D-000

This table gives cross-reference parts and alternative options found for HI1837C-D-000. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HI1837C-D-000, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
HB1837C-Y-000 MASK ROM, 4KX8, 1375ns, CMOS, CDIP24 Hughes Aircraft HI1837C-D-000 vs HB1837C-Y-000
HI1837C-Y-000 MASK ROM, 4KX8, 1375ns, CMOS, CDIP24 Hughes Aircraft HI1837C-D-000 vs HI1837C-Y-000
HI23C32C-Y-000 MASK ROM, 4KX8, 1375ns, CMOS, CDIP24 Hughes Aircraft HI1837C-D-000 vs HI23C32C-Y-000
H23C32CP MASK ROM, 4KX8, 1375ns, CMOS, PDIP24 Hughes Aircraft HI1837C-D-000 vs H23C32CP
Part Number Description Manufacturer Compare
AM2732B-205DC UVPROM, 4KX8, 200ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 AMD HI1837C-D-000 vs AM2732B-205DC
5962-9065801JX UVPROM, 4KX8, 70ns, CMOS, CDIP24, CERAMIC, DIP-24 Waferscale Integration Inc HI1837C-D-000 vs 5962-9065801JX
LD2732A-2 UVPROM, 4KX8, 250ns, HMOS, CDIP24, CERAMIC, DIP-24 Intel Corporation HI1837C-D-000 vs LD2732A-2
AM2732B-205DI UVPROM, 4KX8, 200ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 AMD HI1837C-D-000 vs AM2732B-205DI
WS57C43B-70D UVPROM, 4KX8, 70ns, CMOS, CDIP24, Waferscale Integration Inc HI1837C-D-000 vs WS57C43B-70D
WS57C43C-25D 4KX8 UVPROM, 25ns, CDIP24, 0.600 INCH, CERDIP-24 STMicroelectronics HI1837C-D-000 vs WS57C43C-25D
PQ36C32-55 EEPROM, 4KX8, 55ns, Parallel, CMOS, PDIP24 LSI Corporation HI1837C-D-000 vs PQ36C32-55
5962-9065804JX UVPROM, 4KX8, 35ns, CMOS, CDIP24, CERAMIC, DIP-24 Waferscale Integration Inc HI1837C-D-000 vs 5962-9065804JX
MD2732A-25 UVPROM, 4KX8, 250ns, CMOS, CDIP24, CERAMIC, DIP-24 Intel Corporation HI1837C-D-000 vs MD2732A-25
WS57C43C-45TMB 4KX8 UVPROM, 45ns, CDIP24, 0.300 INCH, CERDIP-24 STMicroelectronics HI1837C-D-000 vs WS57C43C-45TMB

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