Part Details for IDT7169L25TDB by Integrated Device Technology Inc
Overview of IDT7169L25TDB by Integrated Device Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part Details for IDT7169L25TDB
IDT7169L25TDB CAD Models
IDT7169L25TDB Part Data Attributes
|
|
IDT7169L25TDB
Integrated Device Technology Inc
Buy Now
Datasheet
|
Compare Parts:
IDT7169L25TDB
Integrated Device Technology Inc
Standard SRAM, 8KX9, 25ns, CMOS, CDIP28, 0.300 INCH, CERDIP-28
|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Part Package Code | DIP | |
| Package Description | 0.300 INCH, CERDIP-28 | |
| Pin Count | 28 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 25 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-GDIP-T28 | |
| JESD-609 Code | e0 | |
| Length | 37.211 mm | |
| Memory Density | 73728 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 9 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 8192 words | |
| Number of Words Code | 8000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 8KX9 | |
| Output Characteristics | 3-STATE | |
| Output Enable | YES | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP28,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Screening Level | 38535Q/M;38534H;883B | |
| Seated Height-Max | 5.08 mm | |
| Standby Current-Max | 0.0002 A | |
| Standby Voltage-Min | 2 V | |
| Supply Current-Max | 0.17 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 7.62 mm |
Alternate Parts for IDT7169L25TDB
This table gives cross-reference parts and alternative options found for IDT7169L25TDB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IDT7169L25TDB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| P4C163-25CMBLF | Standard SRAM, 8KX9, 25ns, CMOS, CDIP28, 0.300 INCH, ROHS COMPLIANT, CERAMIC, DIP-28 | Pyramid Semiconductor Corporation | IDT7169L25TDB vs P4C163-25CMBLF |
| P4C163L-25DM | Standard SRAM, 8KX9, 25ns, CMOS, CDIP28, 0.300 INCH, HERMETIC SEALED, CERDIP-28 | Pyramid Semiconductor Corporation | IDT7169L25TDB vs P4C163L-25DM |
| CXK5971AP-25 | Standard SRAM, 8KX9, 25ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, MO-058AB, DIP-28 | Sony Semiconductor | IDT7169L25TDB vs CXK5971AP-25 |
| 5962-8868303XX | SRAM, 8KX9, CMOS, CDIP28, CERAMIC, DIP-28 | Pyramid Semiconductor Corporation | IDT7169L25TDB vs 5962-8868303XX |
| P4C163L-25CMB | Standard SRAM, 8KX9, 25ns, CMOS, CDIP28, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-28 | Pyramid Semiconductor Corporation | IDT7169L25TDB vs P4C163L-25CMB |
| P4C163-25DC | Standard SRAM, 8KX9, 25ns, CMOS, CDIP28, 0.300 INCH, HERMETIC SEALED, CERDIP-28 | Pyramid Semiconductor Corporation | IDT7169L25TDB vs P4C163-25DC |
| P4C163L-25CMLF | Standard SRAM, 8KX9, 25ns, CMOS, CDIP28, 0.300 INCH, ROHS COMPLIANT, CERAMIC, DIP-28 | Pyramid Semiconductor Corporation | IDT7169L25TDB vs P4C163L-25CMLF |
| P4C163L-25DMB | Standard SRAM, 8KX9, 25ns, CMOS, CDIP28, 0.300 INCH, HERMETIC SEALED, CERDIP-28 | Pyramid Semiconductor Corporation | IDT7169L25TDB vs P4C163L-25DMB |
| P4C163L-25CM | Standard SRAM, 8KX9, 25ns, CMOS, CDIP28, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-28 | Pyramid Semiconductor Corporation | IDT7169L25TDB vs P4C163L-25CM |
| 5962-8868303YX | SRAM, 8KX9, CMOS, DIP-28 | Pyramid Semiconductor Corporation | IDT7169L25TDB vs 5962-8868303YX |