There are no models available for this part yet.
Overview of L8C203CM25 by LOGIC Devices Inc
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Internet of Things (IoT)
Smart Cities
CAD Models for L8C203CM25 by LOGIC Devices Inc
Part Data Attributes for L8C203CM25 by LOGIC Devices Inc
|
|
---|---|
Rohs Code
|
No
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
LOGIC DEVICES INC
|
Part Package Code
|
DIP
|
Package Description
|
DIP,
|
Pin Count
|
28
|
Reach Compliance Code
|
unknown
|
ECCN Code
|
EAR99
|
HTS Code
|
8542.32.00.71
|
Access Time-Max
|
25 ns
|
Additional Feature
|
RETRANSMIT
|
Cycle Time
|
35 ns
|
JESD-30 Code
|
R-GDIP-T28
|
Length
|
36.83 mm
|
Memory Density
|
18432 bit
|
Memory IC Type
|
OTHER FIFO
|
Memory Width
|
9
|
Moisture Sensitivity Level
|
3
|
Number of Functions
|
1
|
Number of Terminals
|
28
|
Number of Words
|
2048 words
|
Number of Words Code
|
2000
|
Operating Mode
|
ASYNCHRONOUS
|
Operating Temperature-Max
|
125 °C
|
Operating Temperature-Min
|
-55 °C
|
Organization
|
2KX9
|
Output Characteristics
|
3-STATE
|
Output Enable
|
NO
|
Package Body Material
|
CERAMIC, GLASS-SEALED
|
Package Code
|
DIP
|
Package Shape
|
RECTANGULAR
|
Package Style
|
IN-LINE
|
Parallel/Serial
|
PARALLEL
|
Peak Reflow Temperature (Cel)
|
225
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
5.08 mm
|
Supply Current-Max
|
0.09 mA
|
Supply Voltage-Max (Vsup)
|
5.5 V
|
Supply Voltage-Min (Vsup)
|
4.5 V
|
Supply Voltage-Nom (Vsup)
|
5 V
|
Surface Mount
|
NO
|
Technology
|
CMOS
|
Temperature Grade
|
MILITARY
|
Terminal Form
|
THROUGH-HOLE
|
Terminal Pitch
|
2.54 mm
|
Terminal Position
|
DUAL
|
Width
|
15.24 mm
|
Alternate Parts for L8C203CM25
This table gives cross-reference parts and alternative options found for L8C203CM25. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of L8C203CM25, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
AM7203-25PC | FIFO, 2KX9, 25ns, Asynchronous, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | Rochester Electronics LLC | L8C203CM25 vs AM7203-25PC |
KM75C103AP-25 | FIFO, 2KX9, 25ns, Asynchronous, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | Samsung Semiconductor | L8C203CM25 vs KM75C103AP-25 |
IDT7203L25PI | FIFO, 2KX9, 25ns, Asynchronous, CMOS, PDIP28, PLASTIC, DIP-28 | Integrated Device Technology Inc | L8C203CM25 vs IDT7203L25PI |
IDT7203S25D | FIFO, 2KX9, 25ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERDIP-28 | Integrated Device Technology Inc | L8C203CM25 vs IDT7203S25D |
IDT7203L25D | FIFO, 2KX9, 25ns, Asynchronous, CMOS, CDIP28, CERDIP-28 | Rochester Electronics LLC | L8C203CM25 vs IDT7203L25D |
L8C203CME25 | FIFO, 2KX9, 25ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERDIP-28 | LOGIC Devices Inc | L8C203CM25 vs L8C203CME25 |
5962-8866907XX | FIFO, 2KX9, 25ns, Asynchronous, CMOS, CDIP28, | Teledyne e2v | L8C203CM25 vs 5962-8866907XX |
5962-8866907XX | FIFO, 2KX9, 25ns, Asynchronous, CMOS, CDIP28, CERAMIC, DIP-28 | Cypress Semiconductor | L8C203CM25 vs 5962-8866907XX |
5962-8866907XA | FIFO, 2KX9, 25ns, Asynchronous, CMOS, CDIP28, | Teledyne e2v | L8C203CM25 vs 5962-8866907XA |
CY7C428-25DC | FIFO, 2KX9, 25ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERDIP-28 | Cypress Semiconductor | L8C203CM25 vs CY7C428-25DC |