Part Details for LPC2364FET100 by NXP Semiconductors
Overview of LPC2364FET100 by NXP Semiconductors
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (3 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for LPC2364FET100
Part # | Distributor | Description | Stock | Price | Buy | |
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Win Source Electronics | IC MCU 32BIT 128KB FLASH 100BGA | 3000 |
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$24.4930 / $36.7400 | Buy Now |
Part Details for LPC2364FET100
LPC2364FET100 CAD Models
LPC2364FET100 Part Data Attributes
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LPC2364FET100
NXP Semiconductors
Buy Now
Datasheet
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LPC2364FET100
NXP Semiconductors
IC 32-BIT, FLASH, 72 MHz, RISC MICROCONTROLLER, PBGA100, 9 X 9 MM, 0.70 MM HEIGHT, PLASTIC, SOT926-1, TFBGA-100, Microcontroller
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Not Recommended | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | BGA | |
Package Description | 9 X 9 MM, 0.70 MM HEIGHT, PLASTIC, SOT926-1, TFBGA-100 | |
Pin Count | 100 | |
Manufacturer Package Code | SOT-926-1 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Has ADC | YES | |
Address Bus Width | ||
Bit Size | 32 | |
CPU Family | ARM7 | |
Clock Frequency-Max | 25 MHz | |
DAC Channels | YES | |
DMA Channels | YES | |
External Data Bus Width | 16 | |
JESD-30 Code | S-PBGA-B100 | |
JESD-609 Code | e1 | |
Length | 9 mm | |
Moisture Sensitivity Level | 3 | |
Number of I/O Lines | 70 | |
Number of Terminals | 100 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Equivalence Code | BGA100,10X10,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
RAM (bytes) | 34816 | |
ROM (words) | 131072 | |
ROM Programmability | FLASH | |
Seated Height-Max | 1.2 mm | |
Speed | 72 MHz | |
Supply Current-Max | 100 mA | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3.3 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 9 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
Alternate Parts for LPC2364FET100
This table gives cross-reference parts and alternative options found for LPC2364FET100. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of LPC2364FET100, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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LPC2364FET100,518 | LPC2364FET100 - ARM7 with 128 kB flash, 34 kB SRAM, Ethernet, USB 2.0 Device, CAN, and 10-bit ADC BGA 100-Pin | NXP Semiconductors | LPC2364FET100 vs LPC2364FET100,518 |