There are no models available for this part yet.
Overview of M27C256B-20XF3 by STMicroelectronics
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
CAD Models for M27C256B-20XF3 by STMicroelectronics
Part Data Attributes for M27C256B-20XF3 by STMicroelectronics
|
|
|
|---|---|
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Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
STMICROELECTRONICS
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|
Part Package Code
|
DIP
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Package Description
|
0.280 INCH, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-28
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Pin Count
|
28
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Reach Compliance Code
|
compliant
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ECCN Code
|
EAR99
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HTS Code
|
8542.32.00.61
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Access Time-Max
|
150 ns
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I/O Type
|
COMMON
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JESD-30 Code
|
R-CDIP-T28
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|
JESD-609 Code
|
e3
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Length
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36.92 mm
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Memory Density
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262144 bit
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Memory IC Type
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UVPROM
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Memory Width
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8
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Number of Functions
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1
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Number of Terminals
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28
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Number of Words
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32768 words
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Number of Words Code
|
32000
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Operating Mode
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ASYNCHRONOUS
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Operating Temperature-Max
|
125 °C
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Operating Temperature-Min
|
-40 °C
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Organization
|
32KX8
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Output Characteristics
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3-STATE
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Package Body Material
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CERAMIC, METAL-SEALED COFIRED
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Package Code
|
WDIP
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Package Equivalence Code
|
DIP28,.6
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Package Shape
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RECTANGULAR
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Package Style
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IN-LINE, WINDOW
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Parallel/Serial
|
PARALLEL
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Programming Voltage
|
12.75 V
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Qualification Status
|
Not Qualified
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Seated Height-Max
|
5.72 mm
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Standby Current-Max
|
0.0002 A
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Supply Current-Max
|
0.03 mA
|
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Supply Voltage-Max (Vsup)
|
5.25 V
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Supply Voltage-Min (Vsup)
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4.75 V
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Supply Voltage-Nom (Vsup)
|
5 V
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Surface Mount
|
NO
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Technology
|
CMOS
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Temperature Grade
|
AUTOMOTIVE
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Terminal Finish
|
MATTE TIN
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Terminal Form
|
THROUGH-HOLE
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Terminal Pitch
|
2.54 mm
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Terminal Position
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DUAL
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Width
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15.24 mm
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Alternate Parts for M27C256B-20XF3
This table gives cross-reference parts and alternative options found for M27C256B-20XF3. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M27C256B-20XF3, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| SMJ27C256-15JM | UVPROM, 32KX8, 150ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28 | Micross Components | M27C256B-20XF3 vs SMJ27C256-15JM |
| M27C256B-25F6 | 32KX8 UVPROM, 150ns, CDIP28, 0.280 INCH, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-28 | STMicroelectronics | M27C256B-20XF3 vs M27C256B-25F6 |
| TMS27C256-150JL4 | 32KX8 UVPROM, 150ns, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28 | Texas Instruments | M27C256B-20XF3 vs TMS27C256-150JL4 |
| M27C256B-15F7X | 32KX8 UVPROM, 150ns, CDIP28, FRIT SEALED, WINDOWED, CERAMIC, DIP-28 | STMicroelectronics | M27C256B-20XF3 vs M27C256B-15F7X |
| AM27C256-150DE | UVPROM, 32KX8, 150ns, CMOS, CDIP28, DIP-28 | Spansion | M27C256B-20XF3 vs AM27C256-150DE |
| NMC27C256BQM150 | IC 32K X 8 UVPROM, 150 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM | National Semiconductor Corporation | M27C256B-20XF3 vs NMC27C256BQM150 |
| NM27C256QE150 | UVPROM, 32KX8, 150ns, CMOS, CDIP28, WINDOWED, CERDIP-28 | Fairchild Semiconductor Corporation | M27C256B-20XF3 vs NM27C256QE150 |
| 27C256-15/J | 32K X 8 UVPROM, 150 ns, CDIP28, 0.600 INCH, CERDIP-28 | Microchip Technology Inc | M27C256B-20XF3 vs 27C256-15/J |
| TMS27C256-15JE4 | 32KX8 UVPROM, 150ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Texas Instruments | M27C256B-20XF3 vs TMS27C256-15JE4 |
| AM27C256-155DIB | UVPROM, 32KX8, 150ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | M27C256B-20XF3 vs AM27C256-155DIB |