Part Details for M27C64A-30F6 by STMicroelectronics
Overview of M27C64A-30F6 by STMicroelectronics
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- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
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Applications
Industrial Automation
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Part Details for M27C64A-30F6
M27C64A-30F6 CAD Models
M27C64A-30F6 Part Data Attributes
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M27C64A-30F6
STMicroelectronics
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Datasheet
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M27C64A-30F6
STMicroelectronics
8KX8 UVPROM, 300ns, CDIP28, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-28
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | STMICROELECTRONICS | |
| Part Package Code | DIP | |
| Package Description | LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-28 | |
| Pin Count | 28 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 300 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-CDIP-T28 | |
| JESD-609 Code | e3 | |
| Length | 36.92 mm | |
| Memory Density | 65536 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 8192 words | |
| Number of Words Code | 8000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 8KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | WDIP | |
| Package Equivalence Code | DIP28,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE, WINDOW | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 12.5 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.97 mm | |
| Standby Current-Max | 0.0001 A | |
| Supply Current-Max | 0.03 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for M27C64A-30F6
This table gives cross-reference parts and alternative options found for M27C64A-30F6. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M27C64A-30F6, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AM2764A-30DE | UVPROM, 8KX8, 300ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | AMD | M27C64A-30F6 vs AM2764A-30DE |
| AM2764A-30DIB | UVPROM, 8KX8, 300ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | AMD | M27C64A-30F6 vs AM2764A-30DIB |
| MBM27C64-30-XZ | 8KX8 UVPROM, 300ns, CDIP28, CERDIP-28 | FUJITSU Limited | M27C64A-30F6 vs MBM27C64-30-XZ |
| 27C64MQ30 | UVPROM, 8KX8, 300ns, CMOS, CDIP28, CERAMIC, DIP-28 | Thales Group | M27C64A-30F6 vs 27C64MQ30 |
| AM27C64-305DCB | UVPROM, 8KX8, 300ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | M27C64A-30F6 vs AM27C64-305DCB |
| MBM2764-30-XZ | UVPROM, 8KX8, 300ns, NMOS, CDIP28, CERDIP-28 | FUJITSU Semiconductor Limited | M27C64A-30F6 vs MBM2764-30-XZ |
| AM27C64-300DC | UVPROM, 8KX8, 300ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | M27C64A-30F6 vs AM27C64-300DC |
| MBM2764-30-XZ | 8KX8 UVPROM, 300ns, CDIP28, CERDIP-28 | FUJITSU Limited | M27C64A-30F6 vs MBM2764-30-XZ |
| QD2764-30 | UVPROM, 8KX8, 300ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | Intel Corporation | M27C64A-30F6 vs QD2764-30 |
| AM2764A-30DEB | UVPROM, 8KX8, 300ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | AMD | M27C64A-30F6 vs AM2764A-30DEB |