M38510/20302BEA by:

256X4 OTPROM, 75ns, DIP16, 0.25 X 0.875 INCH, DIP-16

Part Details for M38510/20302BEA by Texas Instruments

Overview of M38510/20302BEA by Texas Instruments

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Applications Aerospace and Defense Transportation and Logistics Automotive

Part Details for M38510/20302BEA

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M38510/20302BEA Part Data Attributes

M38510/20302BEA Texas Instruments
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M38510/20302BEA Texas Instruments 256X4 OTPROM, 75ns, DIP16, 0.25 X 0.875 INCH, DIP-16
Part Life Cycle Code Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP
Package Description DIP,
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 125 ns
JESD-30 Code R-XDIP-T16
Memory Density 524288 bit
Memory IC Type OTP ROM
Memory Width 8
Number of Functions 1
Number of Terminals 16
Number of Words 256 words
Number of Words Code 64000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 64KX8
Package Body Material UNSPECIFIED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Screening Level MIL-M-38510 Class B
Supply Current-Max 0.04 mA
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology BIPOLAR
Temperature Grade MILITARY
Terminal Form THROUGH-HOLE
Terminal Position DUAL

Alternate Parts for M38510/20302BEA

This table gives cross-reference parts and alternative options found for M38510/20302BEA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M38510/20302BEA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
M38510/20302SEA IC 256 X 4 OTPROM, 75 ns, DIP16, 0.25 X 0.875 INCH, DIP-16, Programmable ROM NXP Semiconductors M38510/20302BEA vs M38510/20302SEA
M38510/20302BEA OTP ROM, 256X4, 75ns, Bipolar, 0.25 X 0.875 INCH, DIP-16 Teledyne e2v M38510/20302BEA vs M38510/20302BEA
M38510/20302SEX IC 256 X 4 OTPROM, 75 ns, DIP16, 0.25 X 0.875 INCH, DIP-16, Programmable ROM NXP Semiconductors M38510/20302BEA vs M38510/20302SEX
M38510/20301BEX IC 256 X 4 OTPROM, 75 ns, DIP16, 0.25 X 0.875 INCH, DIP-16, Programmable ROM NXP Semiconductors M38510/20302BEA vs M38510/20301BEX
M38510/20301BEA OTP ROM, 256X4, 75ns, Bipolar, 0.25 X 0.875 INCH, DIP-16 Teledyne e2v M38510/20302BEA vs M38510/20301BEA
M38510/20302BEX OTP ROM, 256X4, 75ns, Bipolar, 0.25 X 0.875 INCH, DIP-16 Teledyne e2v M38510/20302BEA vs M38510/20302BEX
TBP24SA10MJ 256X4 OTPROM, 75ns, CDIP16, CERAMIC, DIP-16 Texas Instruments M38510/20302BEA vs TBP24SA10MJ
M38510/20301BEA IC 256 X 4 OTPROM, 75 ns, DIP16, 0.25 X 0.875 INCH, DIP-16, Programmable ROM NXP Semiconductors M38510/20302BEA vs M38510/20301BEA
TBP24S10MJ 256X4 OTPROM, 75ns, CDIP16, CERAMIC, DIP-16 Texas Instruments M38510/20302BEA vs TBP24S10MJ
M38510/20301BEX OTP ROM, 256X4, 75ns, Bipolar, 0.25 X 0.875 INCH, DIP-16 Lansdale Semiconductor Inc M38510/20302BEA vs M38510/20301BEX
Part Number Description Manufacturer Compare
N82S126AN OTP ROM, 256X4, 30ns, Bipolar, PDIP16, YAGEO Corporation M38510/20302BEA vs N82S126AN
AM27S20PC OTP ROM, 256X4, 45ns, Bipolar, PDIP16, PLASTIC, DIP-16 AMD M38510/20302BEA vs AM27S20PC
N82S229F OTP ROM, 256X4, 50ns, Bipolar, CDIP16, Signetics M38510/20302BEA vs N82S229F
AM27S20/BEA OTP ROM, 256X4, 60ns, Bipolar, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 AMD M38510/20302BEA vs AM27S20/BEA
N82S126N OTP ROM, 256X4, 50ns, Bipolar, PDIP16, Signetics M38510/20302BEA vs N82S126N
M54701AS-1 OTP ROM, 256X4, 30ns, Bipolar, CDIP16, METAL SEALED, CERAMIC, DIP-16 Mitsubishi Electric M38510/20302BEA vs M54701AS-1
53S141AJ OTP ROM, 256X4, 40ns, CMOS, CDIP16, Monolithic Memories (RETIRED) M38510/20302BEA vs 53S141AJ
M38510/20304BEA OTP ROM, 256X4, 35ns, Bipolar, 0.25 X 0.875 INCH, DIP-16 Teledyne e2v M38510/20302BEA vs M38510/20304BEA
M38510/20302SEX IC 256 X 4 OTPROM, 75 ns, DIP16, 0.25 X 0.875 INCH, DIP-16, Programmable ROM NXP Semiconductors M38510/20302BEA vs M38510/20302SEX
M38510/20301BEX IC 256 X 4 OTPROM, 75 ns, DIP16, 0.25 X 0.875 INCH, DIP-16, Programmable ROM NXP Semiconductors M38510/20302BEA vs M38510/20301BEX

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